High resolution traceability

A system for monitoring for an electronic circuit production line, the system comprising:

• at least one imaging system operable to acquire at least one image of a packaging unit (PU) label labeling a PU in which an electronic component that the production line includes in an electronic circuit is packaged, and during production of the circuit at least one image of the component;
• and
• a processing and data hub having software comprising at least one neural network configured to process the image of the PU label to identify a supplier of the PU and a symbol string comprising at least one symbol imaged in the label, parse the symbol string and determine semantics of the parsed symbol string to provide logistical data characterizing the PU, and wherein the software is configured to:
• create a PU data record having logistical data fields comprising the logistical data characterizing the PU, and assembly line set-up data at a time at which the PU is mounted to a pick and place machine of the assembly line;
• process the at least one image of the component to
• create an encapsulation data record having logistical data fields comprising logistical data characterizing an encapsulation package of the component and identifying a supplier of the component;
• process the PU data record and encapsulation data records respectively for internal consistency and consistency of the PU data record with the encapsulation data record;
• and
• store the PU and encapsulation data records in a memory.