On-chip distribution of test data for multiple dies
AssigneesAdvanced Micro Devices Products (China) Co., Ltd., ATI Technologies ULC
InventorsArie Margulis, Tassanee Payakapan, Yuan Chao
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Abstract
A multi-die integrated circuit uses an on-chip test distribution module to distribute test data to different dies, such as processor chiplets. The test distribution module receives test input data from an external source via one or more integrated circuit pins and distributes the test input data to the different dies, such that the different dies are able to concurrently apply the test data to one or more circuits. Based on application of the test input data the different dies concurrently generate corresponding test results that are used to identify and address design or operation errors at the dies.
Claims20
An integrated circuit comprising:
- a plurality of semiconductor dies comprising multiple die types of semiconductor dies;
- a set of pins configured to receive test input data from a device external to the integrated circuit;
- and
- a test distribution circuitry configured to concurrently distribute the received test input data to a first subset of the plurality of semiconductor dies belonging to a first die type of the multiple die types of semiconductor dies based on received control information.
An integrated circuit comprising:
- a plurality of semiconductor dies comprising multiple die types of semiconductor dies;
- a set of pins configured to receive test input data from a device external to the integrated circuit;
- and
- a test distribution circuitry configured to select a first subset of the plurality of semiconductor dies belonging to a first die type of the multiple die types of semiconductor dies or a second subset of the plurality of semiconductor dies belonging to a second die type of the multiple die types of semiconductor dies and to concurrently distribute the received test input data to the selected first or second subset of the plurality of semiconductor dies based on received control information.
A method, comprising:
- receiving, at a set of pins of an integrated circuit comprising a plurality of dies comprising multiple die types, test input data from a device external to the integrated circuit;
- and
- concurrently distributing the test input data to a subset of the plurality of dies of the integrated circuit belonging to a first die type of the multiple die types of based on control information received via the set of pins.
Dependencies are inferred from the claim text.