Enhanced direct current (DC) built-in-self-test (BIST) coverage for optical engines and advanced packaging
AssigneeCisco Technology, Inc.
InventorsSanjay Sunder, Alexander C. Kurylak
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AssigneeCisco Technology, Inc.
InventorsSanjay Sunder, Alexander C. Kurylak
Estimating the term…
Techniques for testing connectivity between a first integrated circuit (IC) and a second IC of an electronics package are described. An example technique involves controlling a switch(es) in the first IC to configure a bias direction of a photodiode of the second IC to forward biased. A connectivity test between the first and second ICs is performed, when the photodiode is forward biased. Another technique involves controlling a switch(es) in the first IC to configure a bias direction of a photodiode in the second IC to reverse biased. A first voltage is measured at an input of a transimpedance amplifier (TIA) in the first IC when the photodiode is reverse biased. The switch(es) are controlled to change the bias direction of the photodiode to forward biased. A second voltage is measured at the input of the TIA when the photodiode is forward biased.
A method for testing connectivity between a first integrated circuit (IC) and a second IC of an electronics package, the method comprising:
An apparatus comprising:
An electronics package comprising:
Dependencies are inferred from the claim text.