Large probe head for testing electronic devices and related manufacturing method

A method for manufacturing a probe head for the functionality testing of devices under test, comprising the steps of:

• providing a containment element;
• arranging a lower guide at a lower face of the containment element, the lower face facing towards the devices under test during the test;
• and
• arranging an upper guide at an upper face of the containment element, the upper face being opposite the lower face,
• wherein the containment element is interposed between the lower guide and the upper guide, and
• wherein the guides are in the shape of at least one single plate when they are connected to the containment element,
• the method further comprising the steps of:
• cutting at least one of the lower guide or the upper guide thereby defining a plurality of guide portions which are independent and separated from each other, starting from said at least one single plate;
• and
• inserting contact elements into guide holes formed in the guides, the contact elements being adapted to contact pads of the devices under test, and
• wherein the method further comprises a sequence in which first the connection of the guides, which are in the form of a single plate, to the containment element is performed, and then the cutting of at least one of the guides into separated guide portions is performed.