Adaptive chip testing apparatus and formation method thereof

An adaptive die testing apparatus, comprising:

• a support frame capable of moving along a vertical direction;
• a movable panel capable of moving along a horizontal direction;
• an upper test socket installed on the support frame;
• and
• a lower test socket installed on the movable panel and capable of moving with the movable plate to directly below the upper test socket, wherein:
• a groove is formed on a lower surface of the upper test socket and/or an upper surface of the lower test socket;
• and
• when the adaptive die testing apparatus is at a testing state, the lower surface of the upper test socket is in a close contact with the upper surface of the lower test socket, and a sealed chamber for placing a die to-be-tested is formed at a region of the groove;
• a PCB (printed circuit board) and a separation plate are stacked sequentially above the upper test socket;
• the upper test socket, the PCB and the separation plate, which are fixed connected to each other, are connected to the support frame through an installation plate disposed above the separation plate;
• an end of a pipeline sequentially passes through the installation plate, the separation plate, the PCB and the upper test socket and is connected to the sealed chamber, and another end of the pipeline is configured to be connected to a high-pressure gas source;
• and the separation plate, the PCB and the upper test socket are fixedly connected to each other through at least two sets of bolts and nuts.

A formation method of an adaptive die testing apparatus, comprising:

• disposing a support frame capable of moving along a vertical direction and a movable panel capable of moving along a horizontal direction;
• installing an upper test socket on the support frame;
• and
• installing a lower test socket on the movable panel, wherein the lower test socket is capable of moving with the movable plate to directly below the upper test socket, wherein:
• a groove is formed on a lower surface of the upper test socket and/or an upper surface of the lower test socket;
• when the adaptive die testing apparatus is at a testing state, the lower surface of the upper test socket is in a close contact with the upper surface of the lower test socket, and a sealed chamber for placing a die to-be-tested is formed at a region of the groove;
• a PCB (printed circuit board) and a separation plate are stacked sequentially above the upper test socket;
• the upper test socket, the PCB and the separation plate, which are fixed connected to each other, are connected to the support frame through an installation plate disposed above the separation plate;
• and an end of a pipeline sequentially passes through the installation plate, the separation plate, the PCB and the upper test socket and is connected to the sealed chamber, and another end of the pipeline is configured to be connected to a high-pressure gas source;
• a strip-shaped through hole is formed at an upper surface of the support frame;
• a first protruding strip is at each of lower portions of two opposite inner walls of the strip-shaped through hole;
• a corresponding second protruding strip extending directly above the first protruding strip is at each of upper portions of two opposite side surfaces of the installation plate;
• a strip-shaped block is disposed above each second protruding strip;
• a side of the strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block extends to directly above the second protruding strip and is connected to the second protruding strip through at least two springs;
• and
• when the adaptive die testing apparatus is at a non-testing state, a lower surface of the second protruding strip is adjoined to be in a contact with an upper surface of a corresponding first protruding strip;
• and when the adaptive die testing apparatus is at the testing state, the lower surface of the upper test socket is in a close contact with the upper surface of the lower test socket, and a gap is formed between the lower surface of the second protruding strip and the upper surface of the corresponding first protruding strip.