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US 12,486,979 B2Granted
Flare tips
OwnerJohn W. Olver, Garabit Jack Sarkisinventors
Life of this patent
Estimating the term…
Abstract
A center flare tip assembly (16) and plenum flare tip assembly (18) with arms (20), having the outside of the center flare tip assembly (16), both inside and outside of the tips (18), the outside of the arms (20), and/or adjacent features of the flare tip (12) are covered with a high emissivity thermal layer (14) with an emissivity greater than 0.85. This reduces flare metal temperatures by thirty percent (30%) or greater, and increases flare life by two (2) to five (5) times current life.
Claims19
A flare tip (12) for optimizing a thermal paradigm to reduce temperature adjacent the flare tip (12), comprising:
- a center flare tip assembly (16) having first inner and first outer surfaces, a plenum flare tip assembly (18) having second inner and second outer surfaces encompassing the center flare tip assembly (16), and arms (20) having at least an third outer surface and extending from the center flare tip assembly (16) to the plenum flare tip assembly (18), wherein
- the center flare tip assembly (16), the plenum flare tip assembly (18) and arms (20) are composed of metallic structures;
- the inner surfaces defining an interior space extending from a first end to a second end allowing fluid gas communication therethrough;
- the first outer surface of the center flare tip assembly (16) has a high emissivity thermal layer (14), both the second inner and second outer surfaces of the plenum flare tip assembly (18) are covered by a high emissivity thermal layer (14), the third outer surface of the arms (20) are covered with a high emissivity thermal layer (14), or any surface of the flare tip (12) have a high emissivity thermal layer (14) thereon, or combinations thereof;
- a high emissivity thermal layer (14) disposed on either the first inner surface, or first outer surface, or second inner surface, or second outer surface, or third outer surface or combinations thereof;
- wherein
- the high emissivity thermal layer (14) contains
- from about 5% to about 30% of an inorganic adhesive, from about 45% to about 92% of a filler, and from about 1% to about 20% of one or more emissivity agents;
- or
- from about 5% to about 35% of colloidal silica, colloidal alumina, or combinations thereof;
- from about 23% to about 79% of a filler, from about 1% to about 25% of one or more emissivity agents.
8 more elements
Dependencies are inferred from the claim text.