Light-emitting diode (LED) luminaire assembly and methods
AssigneeEaton Intelligent Power Limited
InventorsPoonam Chavan, Ajay Chidambaram Pillai Swornalatha, Ravi Shankar Panday
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Abstract
A light-emitting diode (LED) luminaire assembly includes a mounting module having a cavity. The luminaire assembly also includes an LED assembly coupled to the mounting module at an end of the cavity, and a driver mounted on a driver plate and configured to provide electricity to the LED assembly, the driver plate coupled to the mounting module. The luminaire assembly further includes one or more reduced thickness sections provided on a series path of thermal conduction between the LED assembly and the mounting module, to facilitate decreased conductive heat transfer therebetween.
Claims20
A light-emitting diode (LED) luminaire assembly, comprising:
- a mounting module comprising a first side and a second side opposite the first side;
- an LED assembly mounted on a baseplate mechanically coupled to the mounting module at the second side of the mounting module;
- and
- a driver mounted on a driver plate and configured to provide electricity to the LED assembly, wherein the driver plate is mechanically coupled to the mounting module at the first side, and further wherein the driver plate is thermally coupled to the mounting module to dissipate heat to the mounting module;
- wherein the baseplate includes one or more reduced thickness sections along a path of thermal conduction between the LED assembly and the mounting module to decrease conductive heat transfer between the LED assembly and the driver,
- wherein the mounting module, the baseplate, and the driver plate define a cavity configured to provide thermal separation between the driver and the LED assembly.
A mounting module for a light-emitting diode (LED) luminaire assembly, comprising:
- a hub forming a cavity, wherein the hub further comprises a baseplate, the baseplate further including a bridge section connecting a projected section with a remaining section, wherein the bridge section with a reduced thickness is disposed along a path of thermal conduction between the projected section and the remaining section;
- and
- a heat sink assembly comprising a plurality of fin assemblies extending radially from the hub,
- wherein the bridge section facilitates decreased conductive heat transfer between an LED assembly coupled to the mounting module and a driver of the LED assembly mounted on a driver plate,
- wherein the mounting module is thermally coupled to the driver and configured to dissipate heat received from the driver, and
- wherein the mounting module, the baseplate, and the driver plate define the cavity configured to provide thermal separation between the driver and the LED assembly.
A method of fabricating a light-emitting diode (LED) luminaire assembly, comprising:
- providing a mounting module, wherein the mounting module forms a cavity;
- mounting a baseplate on the mounting module;
- mounting an LED assembly on the baseplate;
- wherein the baseplate includes one or more reduced thickness sections along a path of thermal conduction between the mounting module and the LED assembly;
- mounting a driver plate on the mounting module;
- and
- mounting a driver on the driver plate, wherein the driver is configured to provide electricity to the LED assembly,
- wherein the driver plate is mechanically and thermally coupled to the mounting module to dissipate heat to the mounting module,
- wherein the one or more reduced thickness sections facilitate decreased conductive heat transfer between the LED assembly and the mounting module so that the driver and the LED assembly are operable within a target peak temperature limit, and
- wherein the mounting module, the baseplate, and the driver plate define the cavity configured to provide thermal separation between the driver and the LED assembly.
Dependencies are inferred from the claim text.