US 12,486,473 B2 · Post CMP cleaning composition

Abstract

The invention provides compositions useful in post-CMP cleaning operations where ceria is present. In one aspect, the invention provides a composition comprising a reducing agent; a chelating agent; an amino(C6-C12 alkyl)alcohol; and water; wherein the composition has a pH of less than about 8. The compositions of the invention were found to show improved ceria removal on, for example, poly silicon (poly Si) substrates. Also provided is a method for cleaning a microelectronic device substrate using such compositions and a kit comprising, in one or more containers, selected components of the compositions.

Claims9

Dependent claims

A method for removing residues on a microelectronic device substrate, the method comprising:

contacting the surface of a microelectronic device substrate with a composition comprising:
a. a reducing agent;
b. a chelating agent;
c. an amino (C6-C12 alkyl)alcohol;
and
d. water;
wherein the composition has a pH of less than about 8, and wherein the composition further comprises 4-(2-hydroxyethyl)-1-piperazineethanesulfonic acid, or a salt thereof, and at least partially removing the residues from the substrate.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application

18/124,355Filed 21 Mar 2023 · us provisional application

Priority

23 Mar 2022

Published

US 2023/0323248 A112 Oct 2023

Granted

2 Dec 2025

Term ends

Not estimatedThe source records don’t support an estimate.

Classification21 codes

C11D 3/0042
Other compounding ingredients characterised by their effect: reducing agents
C11D 1/66
Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent: non-ionic compounds
C11D 3/042
Water-soluble compounds: acids
C11D 3/2075
Containing oxygen: carboxylic acids-salts thereof

Post CMP cleaning composition

Life of this patent

Post CMP cleaning composition

Life of this patent

Abstract

Claims9