Method and application of isotropic shrinkage of three-dimensional micro-nanostructure

A method of isotropic shrinkage of a three-dimensional micro-nanostructure, comprising the following steps:

• S1, spin-coating a high polymer solution on a substrate, and then performing heat-baking, so as to obtain a high polymer film, wherein the high polymer solution is formed by evenly mixing a high polymer material and a solvent, and the high polymer material is one or more of organic polymers with a molecular weight of ≥1000;
• the high polymer material is selected from at least one of polyethylene glycol, polypropylene glycol, polybutylene glycol, polyvinyl chloride, polystyrene, polyisobutylene, polyvinyl alcohol, polyallyl alcohol, a polychloroprene vinylidene chloride-vinyl chloride copolymer, a vinylidene chloride-vinyl chloride copolymer, polychloroprene, and polybutadiene;
• S2, etching the high polymer film to expose a portion of a surface of the substrate, thereby forming an etched area, and then processing a raw material of a three-dimensional structure into a target three-dimensional structure with the etched area as an initial processing position, so that the target three-dimensional structure is located at a bottom of the etched area and is in contact with the surface of the substrate, while a bottom of other portions is in contact with a surface of an unetched high polymer film, wherein an area ratio of the etched area to a bottom of the target three-dimensional structure is 1:(2 to 100);
• the high polymer film and the raw material of the three-dimensional structure have different polarities, so that they are insoluble in each other;
• the raw material of the three-dimensional structure is selected from a metal ion gel composite, a metal ion photosensitive resin, a quantum dot resin, or a metal nanoparticle photosensitive resin;
• the processing of the raw material of the three-dimensional structure into the target three-dimensional structure is performed by a technology selected from at least one of inkjet printing, aerosol printing, femtosecond laser direct writing, and stereolithography;
• S3, performing a stiffness strengthening treatment on the target three-dimensional structure, and then immersing the target three-dimensional structure in the solvent to dissolve the unetched high polymer film to obtain a three-dimensional micro-nano polymer structure;
• S4, performing pyrolysis on the three-dimensional micro-nano polymer structure to obtain an isotropically shrunk three-dimensional micro-nanostructure.