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US 12,485,664 B2Granted
Lamination apparatus and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Ting Chiu, Ying-Jui Huang, Chien-Ling Hwang, Ching-Hua Hsieh
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Abstract
A method for laminating a film to a wafer and apparatus for performing the lamination process are disclosed. The method includes providing the wafer and the film in a process chamber where the wafer and the film are separated from each other, achieving a vacuum state and a process temperature in the process chamber, and laminating the film to contact a surface of the wafer.
Claims20
A method for laminating a film to a wafer, comprising:
- providing the wafer at a first side of a process chamber and the film at a second side of the chamber, the wafer and the film being separated from each other, wherein a plate and a jig around the plate are positioned at the second side of the chamber, and the film is positioned below the jig and the plate;
- achieving a vacuum state and a process temperature in the process chamber;
- and
- by moving the plate and the jig toward the first side, laminating the film to a surface of the wafer.
1 more element
A method for performing a lamination process, comprising:
- positioning a substrate at a first side of a chamber and positioning a process film at a second side of the chamber opposite to the first side, wherein the process film is positioned through a surface adhesion between the process film and a silicone rubber located at the second side of the chamber;
- obtaining an enclosed space in the chamber that is heated and vacuumed;
- and
- applying a pressure to the silicone rubber and the process film to press the process film against the substrate, wherein applying the pressure to the silicone rubber and the process film includes actuating connecting rods located at the second side of the chamber to push down the process film.
1 more element
A method for performing a lamination process, comprising:
- providing a process chamber comprising an upper chamber, a lower chamber, and an inner space between the upper chamber and the lower chamber, the lower chamber operable to support a substrate and the upper chamber operable to carry a process film to be laminated on the substrate, wherein a silicone rubber is configured to the upper chamber of the process chamber, and the process film is adhered to a flat and smooth surface of the silicone rubber, wherein the silicone rubber includes an anti-electrostatic-type rubber, a room-temperature-vulcanizing rubber, or a fluororubber;
- and
- pressing the process film against the substrate.
Dependencies are inferred from the claim text.