Back to results
US 12,485,515 B2Granted
Slurry arm and chemical mechanical polishing apparatus including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsDonghoon Kwon, Ilyoung Yoon
Life of this patent
Estimating the term…
Abstract
A slurry arm is provided. The slurry arm includes: an arm body; a slurry line that extends through the arm body; an oxygen removal chamber provided in the arm body and configured to receive slurry from the slurry line; a purge gas supplier configured to supply a purge gas to the slurry in the oxygen removal chamber; and a main valve configured to selectively discharge gas from the oxygen removal chamber.
Claims20
A slurry arm comprising:
- an arm body;
- a slurry line that extends through the arm body;
- an oxygen removal chamber provided in the arm body and configured to receive slurry from the slurry line;
- a purge gas supplier configured to supply a purge gas to the slurry in the oxygen removal chamber, wherein the purge gas supplier comprises a bubble diffuser provided in the oxygen removal chamber and configured to generate bubbles from the purge gas, and the bubbles float oxygen from the slurry to a region of the oxygen removal chamber;
- and
- a main valve configured to selectively discharge the purge gas and the oxygen from the oxygen removal chamber.
3 more elements
A slurry arm comprising:
- an arm body;
- a slurry line that extends through the arm body;
- an oxygen removal chamber provided in the arm body and configured to receive slurry from the slurry line;
- a purge gas supplier configured to supply a purge gas to the slurry in the oxygen removal chamber, wherein the purge gas supplier comprises a bubble diffuser provided in the oxygen removal chamber and configured to generate bubbles from the purge gas, and the bubbles float oxygen from the slurry to a region of the oxygen removal chamber;
- a pressure gauge configured to measure an internal pressure of the oxygen removal chamber;
- and
- a relief valve configured to selectively discharge the purge gas and the oxygen from the oxygen removal chamber based on the internal pressure of the oxygen removal chamber measured by the pressure gauge.
4 more elements
A chemical mechanical polishing (CMP) apparatus comprising:
- a polishing head configured to hold a substrate;
- a platen provided under the polishing head;
- a polishing pad provided on an upper surface of the platen and configured to polish the substrate;
- and
- a slurry arm configured to supply slurry to the polishing pad,
- wherein the slurry arm comprises:
- an arm body;
- a slurry line that extends through the arm body;
- an oxygen removal chamber provided in the arm body and configured to receive the slurry from the slurry line;
- a purge gas supplier configured to supply a purge gas to the slurry in the oxygen removal chamber, wherein the purge gas supplier comprises a bubble diffuser provided in the oxygen removal chamber and configured to generate bubbles from the purge gas, and the bubbles float oxygen from the slurry to a region of the oxygen removal chamber;
- and
- a main valve configured to selectively discharge the purge gas and the oxygen from the oxygen removal chamber.
9 more elements
Dependencies are inferred from the claim text.