Sensor device and method for manufacturing sensor device

A method for manufacturing a sensor device having a structure in which a sensor unit is connected to a wiring portion,

• wherein the sensor unit is configured as a sol-gel composite piezoelectric sensor, and is provided with a piezoelectric film layer, an electrode layer formed on the piezoelectric film layer, and a protective layer,
• wherein the electrode layer is covered by the protective layer except for a portion of the electrode layer,
• wherein a portion of the electrode layer that is not covered by the protective layer is flat,
• wherein the wiring portion includes a signal line,
• wherein the signal line is structured with an end including a pressure bonding tip having a flat portion,
• wherein the method comprises:
• housing, in which a housing portion provided to the sensor device is applied so as to cover a portion of the electrode layer that is not covered by the protective layer and an uncovered portion of the signal line;
• and
• pressing, in which the a pressure-applying portion provided to the housing portion is applied so as to press the flat portion of the pressure-bonding tip to the portion of the electrode layer that is not covered by the protective layer so as to provide pressure bonding.