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US 12,484,186 B2Granted
Cooling of electronic components with an electrohydrodynamic flow unit
AssigneeAPR Technologies AB
InventorsAre Björneklett, Peter Nilsson, Robert Thorslund
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Abstract
An arrangement for thermal management is disclosed, wherein a heat generating component is arranged within an enclosure, defined by an enclosure wall and in thermal contact with a thermal management fluid. The arrangement comprises an electrohydrodynamic flow unit, comprising a first and a second electrode, for controlling the flow of fluid within the enclosure.
Claims13
An arrangement for thermal management of a heat generating electronic component, the arrangement comprising:
- the heat generating electronic component arranged within an enclosure and in thermal contact with a dielectric liquid;
- a first electrohydrodynamic (EHD) flow unit arranged within the enclosure, wherein the first EHD flow unit comprises a first electrode and a second electrode arranged offset from the first electrode, and wherein the first EHD flow unit controls a flow of the dielectric liquid between the first electrode and the second electrode;
- and
- an enclosure wall at least partly defining the enclosure, wherein the enclosure wall is directly attached to the heat generating electronic component, thereby defining the enclosure.
1 more element
A method of thermal management of a heat generating electronic component, comprising:
- placing the heat generating electronic component within an enclosure;
- providing a dielectric liquid in thermal contact with the heat generating electronic component;
- placing a first electrohydrodynamic (EHD) flow unit within the enclosure, wherein the first EHD flow unit comprises a first electrode and a second electrode arranged offset from the first electrode, and wherein the first EHD flow unit controls a flow of the dielectric liquid between the first electrode and the second electrode;
- and
- providing an enclosure wall to at least partly define the enclosure, wherein the enclosure wall is attached to the heat generating electronic component, thereby defining the enclosure.
2 more elements
Dependencies are inferred from the claim text.