# US 12,484,152 B2 · Electronic module and apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,484,152 B2 - Document ID: US12484152B2 - Status: Granted - Kind: B2 - Application number: 18/149,330 - Filed: 2023-01-03 - Published: 2023-07-13 - Granted: 2025-11-25 - Earliest claimed: 2022-01-07 - Assignees: Canon Kabushiki Kaisha - Applicants: Canon Kabushiki Kaisha - Inventors: Mitsutoshi Hasegawa - Web page: https://patentgrep.com/patent/US12484152B2 ## CPC - H05K 1/181: associated with surface mounted components - H05K 3/305: {Affixing by adhesive} - H05K 3/321: by conductive adhesives - H10F 39/809: {of hybrid image sensors} - H10F 39/811: {Interconnections} - H05K 2201/10121: Optical component, e.g. opto-electronic component - H05K 2201/10378: Interposers - H05K 2201/10515: Stacked components - H05K 2201/1053: Mounted components directly electrically connected to each other, i.e. not via the PCB - H05K 2201/10719: Land grid array [LGA] - H05K 2201/10727: Leadless chip carrier [LCC], e.g. chip-modules for cards - H05K 2201/10734: Ball grid array [BGA]; Bump grid array - H05K 2201/2036: Permanent spacer or stand-off in a printed circuit or printed circuit assembly - H10F 39/804: {Containers or encapsulations} - H10W 72/072: {of bump connectors} - H10W 72/07354: {changes in dispositions} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/347: {Dispositions of multiple die-attach connectors} - H10W 72/352: {comprising metals or metalloids, e.g. solders} - H10W 72/851: {Dispositions of multiple connectors or interconnections} - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An electronic module includes at least one electronic component including a first principal surface, first and second electrodes on the first principal surface, a wiring board including a second principal surface, third and fourth electrodes on the second principal surface, and a conductive resin portion. The conductive resin portion includes at least one first conductive resin portion joining the first and third electrodes, and at least one second conductive resin portion joining the second and fourth electrodes. The electronic module further includes at least one reinforcing resin portion that is disposed between at least one first and at least one second conductive resin portions and joins the first principal surface of the electronic component with the second principal surface of the wiring board. ## Claims ### Claim 1 An electronic module comprising: a plurality of electronic components including a first electronic component having a first electrode on a principal surface of the first electronic component and a second electronic component having a second electrode on a principal surface of the second component, the second electronic component being disposed adjacent to the first electronic component; a wiring board including a third electrode and a fourth electrode on a principal surface of the wiring board; a conductive resin portion including a first conductive resin portion joining the first electrode with the third electrode, and a second conductive resin portion joining the second electrode with the fourth electrode; and a reinforcing resin portion disposed at least between the first conductive resin portion and the second conductive resin portion, wherein the reinforcing resin portion is disposed to straddle the principal surface of the first electronic component and the principal surface of the second electronic component, and the reinforcing resin portion joining each of the principal surfaces of the first and second electronic components with the principal surface of the wiring board. ### Claim 2 (depends on 1) The electronic module according to claim 1, wherein the reinforcing resin portion is disposed at intervals from the first conductive resin portion and the second conductive resin portion. ### Claim 3 (depends on 1) The electronic module according to claim 1, wherein an aspect ratio H1/L1 representing a ratio of a length H1 of the reinforcing resin portion in a direction perpendicular to the principal surface of the wiring board to a length L1 of the reinforcing resin portion in a direction parallel to the principal surface of the wiring board is less than or equal to 1.0. ### Claim 4 (depends on 3) The electronic module according to claim 3, wherein the aspect ratio H1/L1 falls in a range from 0.4 to 0.8 inclusive. ### Claim 5 (depends on 1) The electronic module according to claim 1, wherein a total volume of the reinforcing resin portion is larger than a total volume of the conductive resin portion. ### Claim 6 (depends on 1) The electronic module according to claim 1, wherein the first conductive resin portion includes a plurality of first conductive resin portions, the second conductive resin portion includes a plurality of second conductive resin portions, and the reinforcing resin portion includes a plurality of reinforcing resin portions, and wherein the plurality of reinforcing resin portions and the plurality of conductive resin portions are disposed in a staggered manner as viewed in a direction perpendicular to the principal surface of the wiring board. ### Claim 7 (depends on 1) The electronic module according to claim 1, wherein the reinforcing resin portion is a cured product of photocurable resin or a cured product of thermosetting resin that starts curing at a temperature lower than a temperature at which the conductive resin portion starts curing. ### Claim 8 (depends on 1) The electronic module according to claim 1, wherein the conductive resin portion includes a cured product of epoxy resin. ### Claim 9 (depends on 1) The electronic module according to claim 1, wherein the conductive resin portion comprises silver or copper. ### Claim 10 (depends on 1) The electronic module according to claim 1, wherein either one of the first electrode and the third electrode includes a bump. ### Claim 11 (depends on 1) The electronic module according to claim 1, wherein the principal surface of the wiring board includes solder resist, and wherein the reinforcing resin portion joins the principal surfaces of the first and second electronic components with the solder resist. ### Claim 12 (depends on 1) The electronic module according to claim 1, wherein the second electronic component is disposed adjacent to the first electronic component in a first direction, the first and second electronic components are larger than the wiring board in a second direction as viewed in a third direction perpendicular to the principal surface of the wiring board, and wherein the first, second and third directions being perpendicular to each other. ### Claim 13 (depends on 1) The electronic module according to claim 1, wherein each of the first and second electronic components includes a material composed of cadmium, zinc, telluride, gallium and/or arsenide. ### Claim 14 (depends on 1) The electronic module according to claim 1, further comprising an integrated circuit electrically connected to the first and second electronic component via the wring board, wherein the integrated circuit is disposed on a side opposite a side where the first and second electronic component are disposed, and the integrated circuit is joined to the wiring board by solder. ### Claim 15 (depends on 1) The electronic module according to claim 1, wherein the reinforcing resin portion is disposed between the first electronic component and the second electronic component. ### Claim 16 (depends on 1) The electronic module according to claim 1, wherein a Vickers hardness of the reinforcing resin portion is higher than a Vickers hardness of the conductive resin portion. ### Claim 17 (depends on 1) The electronic module according to claim 1, wherein a total sum of an area of the first electronic component and an area of the second electronic component is larger than an area of the wiring board as viewed in a direction perpendicular to the principal surface of the wiring board. ### Claim 18 (depends on 1) The electronic module according to claim 1, wherein the first electronic component includes a first photodetector, and the second electronic component includes a second photodetector. ### Claim 19 (depends on 1) An apparatus comprising: a housing; and the electronic module according to claim 1, the electronic module being disposed in the housing. ### Claim 20 (depends on 13) An apparatus comprising: a light source; and the electronic module according to claim 13, the electronic module being disposed at a position at which a light from the light source is receivable by the conductive resin portion. ### Claim 21 (depends on 20) The apparatus according to claim 20, wherein the light source is an X-ray source. ### Claim 22 (depends on 19) The apparatus according to claim 19, further comprising a drive unit to cause the electronic module to rotate in the housing. ### Claim 23 (depends on 1) An apparatus comprising: a plurality of electronic modules each of which is the electronic module according to claim 1; and a member which fixes the plurality of the electronic modules. ### Claim 24 (depends on 1) An apparatus comprising: an X-ray source; and a detector array to detect an X-ray, wherein the detector array comprises a plurality of electronic modules each of which is the electronic module according to claim 1. ### Claim 25 (depends on 24) The apparatus according to claim 24, wherein the apparatus is configured as a computed tomography (CT) imaging system. ### Claim 26 (depends on 14) The electronic module according to claim 14, further comprising a circuit board electrically connected to the wiring board, wherein the integrated circuit is disposed between the wiring board and the circuit board. ### Claim 27 (depends on 12) The electronic module according to claim 12, wherein a total sum of a size of the first electronic component in the first direction and a size of the second electronic component in the first direction is larger than a size of the wiring board in the first direction. ### Claim 28 (depends on 1) The electronic module according to claim 1, wherein the conductive resin portion is a cured product of curable resin that starts curing at a temperature lower than or equal to 60° C. ### Claim 29 (depends on 1) The electronic module according to claim 1, wherein the first electronic component includes an X-ray-sensitive material electrically connected to the third electrode, and the second electronic component includes an X-ray-sensitive material electrically connected to the fourth electrode. ### Claim 30 (depends on 1) The electronic module according to claim 1, wherein each of the first and second electronic components includes a material selected from the group including cadmium zinc telluride, cadmium telluride, and gallium arsenide.