# US 12,484,143 B2 · Reflective cancellations in a connector wipe of a surface mount connector > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,484,143 B2 - Document ID: US12484143B2 - Status: Granted - Kind: B2 - Application number: 18/361,869 - Filed: 2023-07-30 - Published: 2025-01-30 - Granted: 2025-11-25 - Earliest claimed: 2023-07-30 - Assignees: Dell Products L.P. - Applicants: Dell Products L.P. - Inventors: Sandor Farkas; Bhyrav Mutnury - Web page: https://patentgrep.com/patent/US12484143B2 ## CPC - H05K 1/025: {Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H10W44/20)} - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 2201/09709: Staggered pads, lands or terminals; Parallel conductors in different planes - H05K 2201/10318: Surface mounted metallic pins - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A printed circuit board includes a dielectric and a connector. The connector is mounted on the dielectric. The connector includes a first connector lead, a first contact point, and a first connector wipe. The first connector wipe includes a plurality of low impedance bumps. The low impedance bumps create an impedance mismatch between the first connector lead and the first connector wipe. ## Claims ### Claim 1 A printed circuit board comprising: a dielectric; and a connector mounted on the dielectric, the connector including a first connector lead, a first contact point, and a first connector wipe, the first connector wipe including a plurality of low impedance bumps, wherein the low impedance bumps create an impedance mismatch between the first connector lead and the first connector wipe, wherein a first portion of a signal transmitted along the connector lead is provided to a contact in physical communication with the first contact portion and a second portion of the signal is provided along the first connector wipe, and wherein a first signal propagation velocity for the first portion of the signal along the contact is slower than a second signal propagation velocity for the second portion of the signal along the first connector wipe. ### Claim 2 (depends on 1) The printed circuit board of claim 1, wherein the dielectric includes a ground plane below the first connector lead. ### Claim 3 (depends on 1) The printed circuit board of claim 1, wherein the dielectric includes a void below the first connector lead. ### Claim 4 (depends on 1) The printed circuit board of claim 1, wherein the connector further includes: a second connector lead; a second contact point; and a second connector wipe, wherein the second connector wipe a second connector lead, a second contact point, and a second connector wipe, the second connector wipe includes a second plurality of low impedance bumps, wherein the second low impedance bumps create an impedance mismatch between the second connector lead and the second connector wipe. ### Claim 5 (depends on 1) The printed circuit board of claim 1, wherein the first contact point is located between the first connector lead and the first connector wipe. ### Claim 6 (depends on 1) The printed circuit board of claim 1, wherein the connector is a surface mount connector. ### Claim 7 An information handling system comprising: a cable connector having an extension portion and a contact portion; and a printed circuit board including: a dielectric; and a connector mounted on the dielectric, the connector including a first connector lead, a first contact point, and a first connector wipe, the first connector wipe including a plurality of low impedance bumps, wherein the low impedance bumps create an impedance mismatch between the first connector lead and the first connector wipe, wherein a first portion of a signal transmitted along the connector lead is provided to a contact in physical communication with the first contact portion and a second portion of the signal is provided along the first connector wipe, and wherein a first signal propagation velocity for the first portion of the signal along the contact is slower than a second signal propagation velocity for the second portion of the signal along the first connector wipe. ### Claim 8 (depends on 7) The information handling system of claim 7, wherein the dielectric includes a ground plane below the first connector lead. ### Claim 9 (depends on 7) The information handling system of claim 7, wherein the dielectric includes a void below the first connector lead. ### Claim 10 (depends on 7) The printed circuit board of claim 7, wherein the connector further includes: a second connector lead; a second contact point; and a second connector wipe, wherein the second connector wipe a second connector lead, a second contact point, and a second connector wipe, the second connector wipe includes a second plurality of low impedance bumps, wherein the second low impedance bumps create an impedance mismatch between the second connector lead and the second connector wipe. ### Claim 11 (depends on 7) The information handling system of claim 7, wherein the first contact point is located between the first connector lead and the first connector wipe. ### Claim 12 (depends on 7) The information handling system of claim 7, wherein the connector is a surface mount connector. ### Claim 13 A printed circuit board comprising: a dielectric; and a connector mounted on the dielectric, the connector including a first connector lead, a first contact point, and a first connector wipe, the first connector wipe including a plurality of low impedance bumps, wherein the low impedance bumps create an impedance mismatch between the first connector lead and the first connector wipe, wherein the dielectric includes a ground plane below the first connector lead, wherein the dielectric includes a void below the first connector lead, wherein a first portion of a signal transmitted along the connector lead is provided to a contact in physical communication with the first contact portion and a second portion of the signal is provided along the first connector wipe, and wherein a first signal propagation velocity for the first portion of the signal along the contact is slower than a second signal propagation velocity for the second portion of the signal along the first connector wipe, and wherein a first signal propagation velocity for the first portion of the signal along the contact is slower than a second signal propagation velocity for the second portion of the signal along the first connector wipe. ### Claim 14 (depends on 13) The printed circuit board of claim 13, wherein the first contact point is located between the first connector lead and the first connector wipe.