MEMS microphone
AssigneeAAC Technologies Pte. Ltd.
InventorsYuwei Liu, Colin Robert Jenkins, Rui Zhang
Life of this patent
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Abstract
A MEMS microphone, includes a substrate with a back cavity, and a capacitive system arranged on the substrate, the capacitive includes a back plate and a diaphragm, a reinforcing portion is located between the diaphragm and the substrate, a projection of an inner surface of the reinforcing portion along a vibration direction of the diaphragm is flush with an inner surface of the back cavity or located in the back cavity, the reinforcing portion includes an etched barrier wall and a sacrificial layer located within the etched barrier wall. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the reliability.
Claims7
A MEMS microphone, comprising:
- a substrate with a back cavity, and
- a capacitive system arranged on the substrate, comprising a back plate and a diaphragm opposite to the back plate, the diaphragm located between the substrate and the back plate, wherein
- a reinforcing portion is located between the diaphragm and the substrate, a projection of an inner surface of the reinforcing portion along a vibration direction of the diaphragm is flush with an inner surface of the back cavity or located in the back cavity, the reinforcing portion comprises an etched barrier wall and a sacrificial layer located within the etched barrier wall.
Dependencies are inferred from the claim text.