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US 12,482,943 B2Granted
Radio frequency module and communication device
AssigneeMurata Manufacturing Co., Ltd.
InventorTakanori Uejima
Life of this patent
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Abstract
A radio frequency module includes submodules and a connection board that connects the submodule and the submodule. The submodule includes a module board and a first component arranged on the module board, the submodule includes a module board and a second component arranged on the module board, and the connection board is directly connected to the module boards and electrically connects the first component and the second component.
Claims18
A radio frequency module comprising:
- a first module;
- a second module;
- and
- a connection board connecting the first module and the second module, wherein
- the first module includes a first module board and a first component arranged on the first module board,
- the second module includes a second module board and a second component arranged on the second module board,
- the connection board is directly connected to the first module board and the second module board, and electrically connects the first component and the second component
- the first module further includes a fourth component,
- the first module board has a first principal surface and a second principal surface, the first principal surface and the second principal surface facing one another,
- the first component is arranged on one of the first principal surface and the second principal surface, and
- the fourth component is arranged on another of the first principal surface and the second principal surface.
8 more elements
Dependencies are inferred from the claim text.