Method for controlling boat/strip type solder ball placement system

A method for controlling a solder ball placement system capable of mounting solder balls on any one of a boat carrier type material and a substrate strip type material, the method comprising:

• checking a magazine loaded thereon to determine whether a manufacturing method of a material loaded on the magazine is a boat carrier method or a substrate strip method;
• controlling at least one of operation setting information and internal components of the solder ball placement system according to the manufacturing method of the material;
• and
• mounting the solder balls on the material based on the operation setting information,
• wherein the controlling of the at least one of the operation setting information and the internal components includes setting a pre-alignment tool to be in an active state when the material is manufactured by the boat carrier method and in an inactive state when the material is manufactured by the substrate strip method,
• wherein, when the manufacturing method is the boat carrier method, the mounting of the solder balls includes:
• gripping the material by a gripper configured to pick up the material;
• transferring the material by the gripper to a transferring unit;
• and
• aligning units of the material transferred to the transferring unit by the pre-alignment tool,
• wherein, when the manufacturing method is the substrate strip method, the mounting of the solder balls includes:
• gripping the material by the gripper;
• moving the gripper to a position suitable for transfer to the transferring unit;
• transferring the material by the gripper to the transferring unit;
• and
• pushing the material by the gripper and vacuum-sucking, by the transferring unit, the material placed on the transferring unit.