Method of fabricating array substrate with testing pins

Abstract

A method of fabricating an array substrate is provided. The method includes providing a substrate including a gate pad configured to bond a gate driving integrated circuit, a data pad configured to bond a data driving integrated circuit, and a plurality of peripheral layout gate (PLG) proto-lines connecting the gate pad and the data pad; forming a PLG testing pad on the substrate; forming a shorting bar connecting the PLG testing pad to first terminals of the plurality of PLG proto-lines; forming a plurality of testing pins respectively connected to second terminals of the plurality of PLG proto-lines, wherein the plurality of testing pins are formed in a first dummy region of the substrate, the first dummy region is adjacent to an array substrate region of the substrate; and connecting the plurality of testing pins to a probe unit to test connectivity of the plurality of PLG proto-lines.

Dependencies are inferred from the claim text.