Method for producing a stacked structure

A method for producing a stacked structure comprising a receiver substrate and a surface film, the method comprising:

• a) providing a carrier substrate and an initial substrate, each having a front face and a back face;
• b) forming a buried weakened plane in the carrier substrate by implanting light ions through the front face of the carrier substrate;
• c) joining the carrier substrate and the initial substrate via their respective front faces;
• d) mechanically and/or chemically thinning the initial substrate via its back face to form a donor substrate comprising a donor layer originating from the initial substrate and arranged on the carrier substrate, and the buried weakened plane present in the carrier substrate, the donor substrate having a front face on the side of the donor layer and a back face on the side of the carrier substrate;
• e) providing a receiver substrate having a front face and a back face;
• f) joining the donor substrate and the receiver substrate via their respective front faces;
• and
• g) separating along the buried weakened plane, so as to form the stacked structure comprising the receiver substrate and the surface film including the donor layer and a thin transferred layer that originates from the support substrate.