Gas heating apparatus, semiconductor manufacturing apparatus, heating element, and semiconductor manufacturing method

A gas heating apparatus comprising:

• a heating element having a flat plate shape;
• a heat-resistant enclosure in which a space having a flat plate shape is provided, the heating element being disposed in the space with a gap provided between the heating element and an innermost surface of the heat-resistant enclosure such that the heating element is spaced from the innermost surface of the heat-resistant enclosure;
• a gas inlet joint connected to the heat-resistant enclosure to allow gas to flow into the space;
• a gas outlet joint connected to the heat-resistant enclosure to allow the gas that has passed through the space to flow out;
• and
• an induction coil disposed in parallel with the heating element on a lower surface of the heat-resistant enclosure, the lower surface of the heat-resistant enclosure being between the induction coil and the heating element, the induction coil being configured to inductively heat the heating element on the basis of electric power supplied, wherein
• the heat-resistant enclosure comprises a straightening plate partially disposed in the space,
• the straightening plate comprises a straightening plate portion facing the heating element and a conduit portion extending upward from the straightening plate portion,
• the heating element is positioned below a lower surface of the straightening plate portion and is spaced from the straightening plate portion, and
• the straightening plate portion extends to an inner perimeter of the space.