Coating compositions and methods to enhance SC-1 resistance
AssigneeBrewer Science Inc.
InventorsDaniel Patrick Sweat, Jakub Koza, Jamie Storie
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Abstract
Adhesive additives are disclosed that enhance spin-on carbon (SOC) resistance to SC-1 wet etch. The additives can be formed by reacting a polymer or oligomer (such as an adhesion polymer or adhesion oligomer) with 3,4,5-triacetoxybenzoic acid (TABA). When added to standard SOC layers or used as a primer between an SOC layer and substrate, these additives enhance the adhesion of the SOC layer to TiN and other substrates and reduce undercut during SC-1 wet etch.
Claims16
A method of forming a microelectronic structure, said method comprising:
- optionally forming one or more intermediate layers on a substrate surface, there being an uppermost intermediate layer on said substrate surface, if one or more intermediate layers are present;
- applying a composition to said uppermost intermediate layer, if present, or to said substrate surface, if no intermediate layers are present, said composition comprising a compound comprising a 3,4,5-triacetoxybenzoic acid moiety;
- and
- heating said composition to form a carbon-rich layer.
A method of forming a microelectronic structure, said method comprising:
- optionally forming one or more intermediate layers on a substrate surface, there being an uppermost intermediate layer on said substrate surface, if one or more intermediate layers are present;
- forming a primer layer on said uppermost intermediate layer, if present, or on said substrate surface, if no intermediate layers are present, said primer layer being formed from a composition comprising a compound comprising a 3,4,5-triacetoxybenzoic acid moiety;
- and
- forming a carbon-rich layer on said primer layer.
Dependencies are inferred from the claim text.