Treatment liquid, method for washing substrate, and method for removing resist
AssigneeFUJIFILM Corporation
InventorsTomonori Takahashi, Tetsuya Kamimura
Life of this patent
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Abstract
A treatment liquid for a semiconductor device includes an alkanolamine; a hydroxylamine; an organic solvent; Ca; Fe; and Na, wherein the content of the alkanolamine in the treatment liquid is 0.1% to 5% by mass, the content of the hydroxylamine in the treatment liquid is 0.1% to 30% by mass, and each of the mass ratio of Ca, Fe, and Na with respect to the content of the alkanolamine and the hydroxylamine in the treatment liquid is 10−12 to 10−4.
Claims17
A treatment liquid for a semiconductor device, comprising:
- an organic alkali compound;
- a corrosion inhibitor;
- an organic solvent;
- Ca;
- Fe;
- and
- Na,
- wherein each of the content of Ca, Fe, and Na with respect to the total mass of the treatment liquid is 0.1 ppb by mass to 10 ppb by mass,
- each of the mass ratio of Ca, Fe, and Na with respect to the organic alkali compound in the treatment liquid is 10−12 to 10−4,
- each of the mass ratio of Ca, Fe, and Na with respect to the corrosion inhibitor in the treatment liquid is 10−12 to 10−4,
- in a case where the viscosity of the treatment liquid at room temperature is measured using a rotational viscometer, the ratio of the viscosity of the treatment liquid at a rotation speed of 100 rpm with respect to the viscosity of the treatment liquid at a rotation speed of 1,000 rpm is 1 to 20, and
- the organic solvent includes an alkylene glycol.
A treatment liquid for a semiconductor device, comprising:
- an organic alkali compound;
- a corrosion inhibitor;
- an organic solvent;
- Ca;
- Fe;
- and
- Na,
- wherein each of the content of Ca, Fe, and Na with respect to the total mass of the treatment liquid is 0.1 ppb by mass to 10 ppb by mass,
- each of the mass ratio of Ca, Fe, and Na with respect to the organic alkali compound in the treatment liquid is 10−12 to 10−4,
- each of the mass ratio of Ca, Fe, and Na with respect to the corrosion inhibitor in the treatment liquid is 10−12 to 10−4,
- in a case where the viscosity of the treatment liquid at room temperature is measured using a rotational viscometer, the ratio of the viscosity of the treatment liquid at a rotation speed of 100 rpm with respect to the viscosity of the treatment liquid at a rotation speed of 1,000 rpm is 1 to 20,
- the organic alkali compound includes an alkanolamine, and
- the pH of the treatment liquid is 11 or more.
A treatment liquid for a semiconductor device, comprising:
- an organic alkali compound;
- a corrosion inhibitor;
- an organic solvent;
- Ca;
- Fe;
- and
- Na,
- wherein each of the content of Ca, Fe, and Na with respect to the total mass of the treatment liquid is 0.1 ppb by mass to 10 ppb by mass,
- each of the mass ratio of Ca, Fe, and Na with respect to the organic alkali compound in the treatment liquid is 10−12 to 10−4,
- each of the mass ratio of Ca, Fe, and Na with respect to the corrosion inhibitor in the treatment liquid is 10−12 to 10−4,
- in a case where the viscosity of the treatment liquid at room temperature is measured using a rotational viscometer, the ratio of the viscosity of the treatment liquid at a rotation speed of 100 rpm with respect to the viscosity of the treatment liquid at a rotation speed of 1,000 rpm is 1 to 20,
- the organic alkali compound includes an alkanolamine, and
- the pH of the treatment liquid is more than 9 and less than 15.
Dependencies are inferred from the claim text.