Silicon photonic systems for LIDAR applications

A light detection and ranging (LIDAR) system, comprising:

• a chassis comprising an opening;
• an insert to be received in the opening, the insert comprising a thermally conductive material;
• a photonic integrated circuit (PIC) attached to the insert;
• a lid attached to the chassis to form a cavity, wherein the PIC is in the cavity;
• an electrical integrated circuit (EIC) connected to the chassis, wherein the EIC is in the cavity and is electrically coupled with the PIC;
• a first connector connected to the chassis and in communicatively coupled with the PIC;
• and
• a second connector, comprising:
• a first rigid printed circuit board (PCB) connected to the first connector,
• a second rigid PCB, and
• a flexible PCB comprising electrical communications pathways between the first rigid PCB and the second rigid PCB.

A system, comprising:

• a chassis comprising an opening;
• an insert in the opening, the insert comprising a thermally conductive material;
• a photonic integrated circuit (PIC) attached to the insert and thermally coupled with the insert;
• a lid connected to the chassis, wherein the PIC is in a cavity between the lid and the chassis and is thermally coupled with the lid;
• a first connector connected to the chassis and coupled with the PIC;
• and
• a second connector comprising:
• a first rigid printed circuit board (PCB),
• a second rigid PCB, and
• a flexible PCB comprising electrical interconnects between the first rigid PCB and the second rigid PCB.