Curved substrate bubble detection method and detection system

A curved substrate bubble detection system for implementing a curved substrate bubble detection method, wherein the curved substrate bubble detection method comprises:

• providing, by a first light source and a second light source, parallel light incident to a to-be-tested substrate in different incident directions;
• obtaining, by a linear array camera, a first image comprising image information of a first side edge of the to-be-tested substrate, wherein the linear array camera is located in a transmission path of reflected light that is the parallel light provided by the first light source and specularly reflected off the to-be-tested substrate, and is located outside a transmission path of reflected light that is the parallel light provided by the second light source and specularly reflected off the to-be-tested substrate;
• determining location information of a defect region of the to-be-tested substrate according to the first image, and generating a second image comprising image information of the defect region;
• and
• binarizing the second image, and determining that the to-be-tested substrate has a bubble defect in case that there are at least two bright spots in an obtained binarized image, and a distance between any two first bright spots of at least two first bright spots is less than a first preset value, wherein
• the curved substrate bubble detection system comprises an image acquisition structure, the image acquisition structure comprises the linear array camera, the first light source and the second light source, the linear array camera is located in the transmission path of reflected light that is parallel light provided by the first light source and specularly reflected off the to-be-tested substrate, and is located outside the transmission path of reflected light that is parallel light provided by the second light source and specularly reflected off the to-be-tested substrate,
• the linear array camera is configured to obtain the first image comprising image information of an edge of the to-be-tested substrate,
• the curved substrate bubble detection system further comprises a first processing circuit configured to determine location information of the defect region of the to-be-tested substrate according to the first image, and generate the second image comprising image information of the defect region,
• the curved substrate bubble detection system further comprises a second processing circuit configured to binarize the second image, and determine that the to-be-tested substrate has a bubble defect in case that there are at least two bright spots in an obtained binarized image, and a distance between any two first bright spots of at least two first bright spots is less than the first preset value,
• the first processing circuit is configured to compare brightness values of pixels in the first image with a first threshold value, adjust the brightness value of any pixel whose brightness value is greater than the first threshold value to a first brightness value, and adjust the brightness value of any pixel whose brightness value is less than the first threshold value to a second brightness value, wherein a location on the to-be-tested substrate corresponding to the pixel with the first brightness value is a location of the first side edge of the to-be-tested substrate, the first side edge comprises a straight portion and arc portions at two ends of the straight portion, and
• the first processing circuit is further configured to select, with the location of the first side edge as a reference, a rectangular area in each of regions of an active display region of the to-be-tested substrate that are close to the arc portions respectively to obtain the second image.