Mounting device, and method for detecting degree of parallelism of mounting device
AssigneeYamaha Robotics Co., Ltd.
InventorYuichiro Noguchi
Life of this patent
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Abstract
In this method for detecting a degree of parallelism of a mounting device: a triangular pin is arranged at a point A on a placement surface of a stage; a mounting head is lowered, and a height of the mounting head when a holding surface comes into contact with a tip end of the triangular pin is detected using an encoder, after which the triangular pin is moved to a point B and the mounting head is lowered; the height of the mounting head when the holding surface comes into contact with the tip end of the triangular pin is detected by the encoder; and the degree of parallelism between the placement surface of the stage and the holding surface of the mounting head is calculated on the basis of the detected heights at point A and point B.
Claims7
A method for detecting a degree of parallelism of a mounting device mounting a semiconductor chip to a mounted body, the method comprising:
- a preparation step of preparing the mounting device, the mounting device comprising:
- a stage, comprising a placement surface on which the mounted body is placed;
- a mounting head, sucking and holding the semiconductor chip by using a holding surface facing the placement surface of the stage, and moving in Z direction that moves toward or away from the placement surface of the stage;
- and an encoder, detecting a height of the mounting head;
- a height detection step of, at a plurality of measurement positions, repetitively executing an operation of disposing a measurement tool of a predetermined height at one of the measurement positions on the placement surface of the stage, lowering the mounting head and detecting a height of the mounting head by using the encoder at a time when the holding surface contacts an upper end of the measurement tool and then moving the measurement tool to another one of the measurement positions on the placement surface, and at the measurement positions, detecting a plurality of heights of the mounting head at the time when the holding surface contacts the upper end of the measurement tool;
- a degree of parallelism calculation step of calculating a degree of parallelism between the placement surface of the stage and the holding surface of the mounting head based on the heights that are detected.
A mounting device, mounting a semiconductor chip to a mounted body, the mounting device comprising:
- a stage, comprising a placement surface on which the mounted body is placed;
- a mounting head, sucking and holding the semiconductor chip by using a holding surface facing the placement surface of the stage, and moving in Z direction that moves toward or away from the placement surface of the stage;
- and
- an encoder, detecting a height of the mounting head;
- a measurement tool, having a predetermined height and disposed on the placement surface of the stage;
- an actuator, moving the measurement tool within the placement surface;
- and
- a controller, adjusting movement of the mounting head and movement of the measurement tool, and calculating a degree of parallelism between the placement surface of the stage and the holding surface of the mounting head based on a height of the mounting head detected by using the encoder,
- wherein the controller is configured to:
- at a plurality of measurement positions, repetitively execute an operation of disposing the measurement tool at one of the measurement positions on the placement surface of the stage by using the actuator, lower the mounting head and detect a height of the mounting head by using the encoder at a time when the holding surface contacts an upper end of the measurement tool and then moving the measurement tool to another one of the measurement positions on the placement surface by using the actuator, and at the measurement positions, detect a plurality of heights of the mounting head at the time when the holding surface contacts the upper end of the measurement tool, and
- calculate the degree of parallelism between the placement surface of the stage and the holding surface of the mounting head based on the heights that are detected.
Dependencies are inferred from the claim text.