Thermally conductive resin composition, cured product, heat transfer member and electronic device

A cured product of a thermally conductive resin composition comprising an epoxy resin and a thermally conductive powder, wherein

• the thermally conductive powder comprises aluminum nitride having a silicon-containing oxide coating on a surface thereof and another thermally conductive powder,
• a content of the epoxy resin is 1% by mass or more and 20% by mass or less based on the total amount of the thermally conductive resin composition,
• a content of the thermally conductive powder is 80% by mass or more and 99% by mass or less based on the total amount of the thermally conductive resin composition, a content of the aluminum nitride having a silicon-containing oxide coating on a surface thereof is 10% by mass or more and 70% by mass or less based on the total amount of the thermally conductive resin composition, and a content of the other thermally conductive powder is 10% by mass or more and 89% by mass or less based on the total amount of the thermally conductive resin composition,
• wherein the cured product has a thermal conductivity of 14 W/m·K or more, and has a rate of reduction in the thermal conductivity of less than 10% after 168 hours in a pressure cooker test at 120° C., 2 atm (0.2 MPa), and 100% relative humidity.