Resin composition and resin molded body thereof
AssigneesInstitute of Science Tokyo, Kanawa Institute of Industrial Science and Technology, Canon Kabishiki Kaisha
InventorsMasaki Azuma, Yuki Sakai, Takahiro Kojima
Life of this patent
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Abstract
The present invention aims to obtain a resin composition with low thermal expansion property by suppressing functional deterioration in negative thermal expansion property when a negative thermal expansion material is added to a thermoplastic resin and heat-processed. The present invention provides a resin composition including metal oxide particles and a thermoplastic resin, both having a negative thermal expansion property. The negative thermal expansion of the particles is attributed to a crystal phase transition, which is driven by electron transfer between the constituent metals, and a covalent protective layer that inhibits the electron transfer is formed between the particles and the thermoplastic resin.
Claims16
A resin composition comprising:
- metal oxide particles with a negative coefficient of linear expansion at 0° C. to 60° C.;
- and
- a thermoplastic resin with a positive coefficient of linear expansion at 0° C. to 60° C.,
- wherein:
- the metal oxide particles change in metal element valence during crystal phase transition;
- a surface of the metal oxide particles is provided with a compound containing at least one metal element selected from the group consisting of Si, Al, and Ti;
- the compound containing the metal element is a condensate of an alkoxide compound represented by formula (1) or (2):
- SiR1n1R2m1 (1)
- wherein:
- R1 is a functional group selected from the group consisting of a methyl group, a methoxy group, and an ethoxy group;
- R2 is a functional group having 8 or less carbon atoms and having an end portion selected from the group consisting of any one of epoxy, amine, imine, and (meth)acryloxy groups;
- n1 is a positive integer;
- m1 is a positive integer or 0;
- and
- n1+m1 is 4;
- M4R3n2R4m2 (2),
- wherein:
- M4 is Al or Ti;
- R3 is a functional group selected from the group consisting of an alkyl group having 8 or less carbon atoms and an alkoxy group having 8 or less carbon atoms;
- R4 is a functional group having 8 or less carbon atoms and having an end portion selected from the group consisting of any one of epoxy, amine, imine, and (meth)acryloxy groups, phosphoric acid ester, and sulfonic acid ester;
- when M4 is Al, n2 is a positive integer, m2 is a positive integer or 0, and n2+m2 is 3;
- and
- when M4 is Ti, n2 is a positive integer, m2 is a positive integer or 0, and n2+m2 is 4;
- and
- the metal oxide particles are particles of a metal oxide represented by formula (A) or (B):
- (Bi1-x1M1x1)(Ni1-x2M2x2)Oy (A),
- wherein:
- M1 is at least one metal element selected from the group consisting of lanthanoids, Y, and In;
- M2 is at least one metal element selected from the group consisting of Al, V, Cr, Mn, Fe, Co, Ga, and Sb;
- x1, x2, and y are such that x1 is 0.02 to 0.15, x2 is 0.02 to 0.50, and y is 3 or less;
- BiNi1-xM3xOy (B),
- wherein:
- M3 is at least one metal element selected from the group consisting of Al, V, Cr, Mn, Fe, Co, Ga, and Sb;
- x is 0.02 to 0.50;
- and
- y is 3 or less.
A resin molded body comprising:
- metal oxide particles with a negative coefficient of linear expansion at 0° C. to 60° C.;
- and
- a resin with a positive coefficient of linear expansion at 0° C. to 60° C.,
- wherein:
- the metal oxide particles change in metal element valence during crystal phase transition;
- a surface of the metal oxide particles is provided with a compound containing at least one metal element selected from the group consisting of Si, Al, and Ti;
- the compound containing the metal element is a condensate of an alkoxide compound represented by formula (1) or (2):
- SiR1n1R2m1 (1)
- wherein:
- R1 is a functional group selected from the group consisting of a methyl group, a methoxy group, and an ethoxy group;
- R2 is a functional group having 8 or less carbon atoms and having an end portion selected from the group consisting of any one of epoxy, amine, imine, and (meth)acryloxy groups;
- n1 is a positive integer;
- m1 is a positive integer or 0;
- and
- n1+m1 is 4;
- M4R3n2R4m2 (2),
- wherein:
- M4 is Al or Ti;
- R3 is a functional group selected from the group consisting of an alkyl group having 8 or less carbon atoms and an alkoxy group having 8 or less carbon atoms;
- R4 is a functional group having 8 or less carbon atoms and having an end portion selected from the group consisting of any one of epoxy, amine, imine, and (meth)acryloxy groups, phosphoric acid ester, and sulfonic acid ester;
- when M4 is Al, n2 is a positive integer, m2 is a positive integer or 0, and n2+m2 is 3;
- and
- when M4 is Ti, n2 is a positive integer, m2 is a positive integer or 0, and n2+m2 is 4;
- and
- the metal oxide particles are particles of a metal oxide represented by formula (A) or (B):
- (Bi1-x1M1x1)(Ni1-x2M2x2)Oy (A),
- wherein:
- M1 is at least one metal element selected from the group consisting of lanthanoids, Y, and In;
- M2 is at least one metal element selected from the group consisting of Al, V Cr, Mn, Fe, Co, Ga, and Sb;
- x1, x2, and y are such that x1 is 0.02 to 0.15, x2 is 0.02 to 0.50, and y is 3 or less;
- BiNi1-xM3xOy (B),
- wherein:
- M3 is at least one metal element selected from the group consisting of Al, V, Cr, Mn, Fe, Co, Ga, and Sb;
- x is 0.02 to 0.50;
- and
- y is 3 or less.
A method of producing a resin molded body which includes metal oxide particles with a negative coefficient of linear expansion at 0° C. to 60° C. and a resin with a positive coefficient of linear expansion at 0° C. to 60° C., wherein the metal oxide particles change in metal element valence during crystal phase transition, the method comprising:
- providing a compound containing at least one metal element selected from the group consisting of Si, Al, and Ti on a surface of the metal oxide particles;
- mixing the metal oxide particles provided with the compound with the resin;
- and
- molding the resin mixed with the metal oxide particles provided with the compound at a temperature of 100° C. to 300° C.,
- wherein the compound containing the metal element is a condensate of an alkoxide compound represented by formula (1) or (2):
- SiR1n1R2m1 (1),
- wherein:
- R1 is a functional group selected from the group consisting of a methyl group, a methoxy group, and an ethoxy group;
- R2 is a functional group having 8 or less carbon atoms and having an end portion selected from the group consisting of any one of epoxy, amine, imine, and (meth)acryloxy groups;
- n1 is a positive integer;
- m1 is a positive integer or 0;
- and
- n1+m1 is 4;
- M4R3n2R4m2 (2),
- wherein:
- M4 is Al or Ti;
- R3 is a functional group selected from the group consisting of an alkyl group having 8 or less carbon atoms and an alkoxy group having 8 or less carbon atoms;
- R4 is a functional group having 8 or less carbon atoms and having an end portion selected from the group consisting of any one of epoxy, amine, imine, and (meth)acryloxy groups, phosphoric acid ester, and sulfonic acid ester;
- when M4 is Al, n2 is a positive integer, m2 is a positive integer or 0, and n2+m2 is 3;
- and
- when M4 is Ti, n2 is a positive integer, m2 is a positive integer or 0, and n2+m2 is 4, and
- wherein the metal oxide particles are particles of a metal oxide represented by formula (A) or (B):
- (Bi1-x1M1x1)(Ni1-x2M2x2)Oy (A),
- wherein:
- M1 is at least one metal element selected from the group consisting of lanthanoids, Y, and In;
- M2 is at least one metal element selected from the group consisting of Al, V, Cr, Mn, Fe, Co, Ga, and Sb;
- x1, x2, and y are such that x1 is 0.02 to 0.15, x2 is 0.02 to 0.50, and y is 3 or less;
- BiNi1-xM3xOy (B),
- wherein:
- M3 is at least one metal element selected from the group consisting of Al, V, Cr, Mn, Fe, Co, Ga, and Sb;
- x is 0.02 to 0.50;
- and
- y is 3 or less.
A resin composition comprising:
- metal oxide particles having a negative coefficient of linear expansion at 0° C. to 60° C. and represented by formula (B):
- BiNi1-xFexO3 (B), where x is 0.02 to 0.50;
- and
- a thermoplastic resin with a positive coefficient of linear expansion at 0° C. to 60° C.,
- wherein the metal oxide particles change in metal element valence during crystal phase transition, and a surface of the metal oxide particles is provided with a protective layer containing Si,
- wherein the protective layer is a condensate of an alkoxide compound having one functional group selected from the group consisting of an epoxy functional group, an amino functional group, and a methacryl functional group, the alkoxide compound reacting under neutral conditions, and
- wherein a converted value of a coefficient of linear expansion of the metal oxide particles in the thermoplastic resin is −178 ppm/° C. to −42 ppm/° C.
Dependencies are inferred from the claim text.