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US 12,479,938 B2Granted
Polymeric resin for dielectric applications
AssigneeRohm and Haas Electronic Materials Korea Ltd.
InventorsColin Hayes, Michael K. Gallagher, Gregory Prokopowicz
Life of this patent
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Abstract
There is provided a resin composition from a mixture including: (a) 60-90 weight % of at least one thermosetting resin; and (b) 10-40 weight % of at least one aryl ether resin. The resin composition can be used in electronics applications.
Claims7
A resin composition from a mixture comprising:
- (a) 60-90 weight % of at least one thermosetting resin based on total non-volatiles;
- and
- (b) 10-40 weight % of at least one aryl ether resin based on total non-volatiles, wherein the at least one thermosetting resin is an arylcyclobutene resin, and the at least one aryl ether resin is selected from the group consisting of Formula (B1)-Formula (B6)
- where n=1 to 10.
1 more element
Dependencies are inferred from the claim text.