MEMS structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFan Hu, Wen-Chuan Tai, Li-Chun Peng, Hsiang-Fu Chen
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Abstract
A MEMS package is provided. The MEMS package includes a metallization layer, a planarization structure, a MEMS device structure, a cap structure and a pressure adjustment element. The planarization structure has an inner sidewall defining a first cavity exposing the metallization layer. The MEMS device structure is bonded to the planarization structure. The MEMS device structure includes a movable element over the first cavity. The cap structure is bonded to the MEMS device structure and has an inner sidewall defining a second cavity facing the movable element. The pressure adjustment element is disposed in the second cavity.
Claims20
A microelectromechanical systems (MEMS) package, comprising:
- a metallization layer over a semiconductor substrate;
- a planarization structure over the metallization layer, having an inner sidewall defining a first cavity exposing the metallization layer;
- a MEMS device structure bonded to the planarization structure, wherein the MEMS device structure comprises a movable element over the first cavity;
- a cap structure bonded to the MEMS device structure, having an inner sidewall defining a second cavity facing the movable element;
- a pressure adjustment element disposed in the second cavity;
- and
- a stopper protruded from the cap structure toward the second cavity and exposed through the pressure adjustment element.
A microelectromechanical systems (MEMS) package, comprising:
- a semiconductor substrate;
- a MEMS device structure over the semiconductor substrate, wherein the MEMS device structure comprises a movable element;
- a cap structure bonded to the MEMS device structure, the cap structure having an inner sidewall defining a first cavity facing the movable element;
- a pressure adjustment element disposed in the first cavity;
- and
- a stopper protruded from the cap structure toward the first cavity and exposed through the pressure adjustment element.
A microelectromechanical systems (MEMS) package, comprising:
- a metallization layer over a semiconductor substrate;
- a MEMS device structure over the metallization layer;
- a cap structure over the MEMS device structure;
- a first cavity between the metallization layer and the MEMS device structure;
- a second cavity between the MEMS device structure and the cap structure;
- a pressure adjustment element disposed over a top surface of the second cavity;
- a first stopper protruded from the cap structure toward the second cavity and exposed through the pressure adjustment element;
- and
- a heating element disposed in the cap structure and coupled to the pressure adjustment element.
Dependencies are inferred from the claim text.