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US 12,479,229 B2Granted
Card with 3D pattern and manufacturing method thereof
AssigneeKona M Co., Ltd.
InventorsJoung Hyun Choi, Ki Sung Nam, Young Hoon Jeong, Jae Min Yang
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Abstract
According to an embodiment of the present disclosure, a method of manufacturing a card by using a card manufacturing device includes the steps of: forming an adhesive layer on a body plate made of a metal material having a preset first surface roughness; performing a vacuum deposition process using a first metal base on the adhesive layer; and print-processing a 3D pattern layer by using UV on a surface of the adhesive layer on which the vacuum deposition process was performed.
Claims7
A method of manufacturing a card by using a card manufacturing device, the method comprising:
- forming an adhesive layer on a body plate made of a metal material having a preset surface roughness;
- forming a metal deposition layer by performing a vacuum deposition process using a first metal base on the adhesive layer;
- forming a first UV pattern layer by printing a first UV pattern on the metal deposition layer using UV;
- forming a printing layer by printing a preset image on the first UV pattern layer;
- and
- forming a second UV pattern layer by printing a second UV pattern on the printing layer using UV, and
- wherein pattern shape of the first UV pattern is different from pattern shape of the second UV pattern.
4 more elements
Dependencies are inferred from the claim text.