Resin profile joining method and resin profile joining device
AssigneeYKK AP Inc.
InventorsIsao Kobayashi, Koji Matsuda
Life of this patent
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AssigneeYKK AP Inc.
InventorsIsao Kobayashi, Koji Matsuda
Estimating the term…
Provided is a resin profile joining method of joining a pair of resin profiles. The method includes: holding one resin profile and another resin profile of the pair of resin profiles with a first mold and a second mold, respectively; heating the end surfaces of the pair of resin profiles in no contact with the end surfaces of the pair of resin profiles to melt the pair of resin profiles; after the heating, moving each of the first mold and the second mold relative to the pair of resin profiles in a longitudinal direction of a corresponding resin profile of the pair of resin profiles; and crimping the end surfaces of the pair of resin profiles to each other while keeping the first mold and the second mold in contact with the surfaces of the pair of resin profiles.
A resin profile joining method of joining a pair of resin profiles, the method comprising:
Dependencies are inferred from the claim text.