Resin-sealing method

Abstract

A resin-sealing method for resin-sealing an electronic component using a mold-clamping apparatus provided with raising-lowering mechanisms including a first raising-lowering mechanism and a second raising-lowering mechanism includes steps below. A resin-sealed product obtained by resin-sealing is measured to measure a total thickness variation which is a difference between a maximum value and a minimum value of a thickness. A height difference between a first part of a movable platen corresponding to the first raising-lowering mechanism and a second part of the movable platen corresponding to the second raising-lowering mechanism is determined such that the total thickness variation becomes smaller. The first raising-lowering mechanism and the second raising-lowering mechanism are driven such that the first part and the second part form the height difference. Mold clamping is performed in a state maintaining the height difference.

Dependencies are inferred from the claim text.