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US 12,478,010 B2Granted
Integrated ceiling device with mechanical arrangement for a light source
AssigneeLighting Defense Group, LLC
InventorDaniel S. Spiro
Life of this patent
Estimating the term…
Abstract
An integrated ceiling device includes integrated ceiling device including an electronic device housing, a heat dissipating structure, a light source, and a reflection/refraction assembly. An air gap is defined between the electronics housing and other components allowing ambient air to flow therethrough for cooling.
Claims30
An integrated ceiling device comprising:
- a heat dissipating structure comprising
- a unitary heat sink coupled to a plurality of fins disposed on top of the heat sink and distributed around a perimeter of the heat sink, and
- a protective ring that couples to the outer perimeter of the heat dissipating structure, an end of at least a subset of the plurality of fins extend out toward the protective ring;
- an electronics housing sized to retain an electronics assembly therein,
- at least a portion of the electronics housing is disposed above a central portion of the heat dissipating structure and has a vertical axis that is substantially aligned vertical axes of a central through opening and the heat dissipating structure,
- a gap between the heat dissipating structure and the electronics housing enables the flow of air through the central opening to above the electronics housing, wherein
- a plurality of second through openings form a through air gap between the protective ring and an outer perimeter of the heat dissipating structure,
- the central through opening being radially closer to the vertical axis of the heat dissipating structure than the plurality of second through openings,
- the electronics housing is enclosed and coupled to the heat dissipating structure,
- the heat dissipating structure is electrically coupled to the electronics housing and at least one light source couples to a bottom of the heat sink, and
- respective exterior surfaces of the electronics housing and the heat dissipating structure are exposed to allow air flow.
8 more elements
An integrated ceiling device comprising:
- an electronics housing configured to retain an electronics assembly therein;
- a heat dissipating structure comprising a unitary heat sink coupled to a plurality of fins disposed on top of the heat sink and around a perimeter of the heat sink;
- a light source;
- and
- at least one mechanical arm extends between the electronics housing and the heat dissipating structure to form a through air gap therebetween, wherein
- the electronics housing
- supports a weight of the integrated ceiling device,
- is at least partially disposed above the heat dissipating structure,
- is positioned to have a central axis that is substantially aligned with a vertical axis of a central through opening, and a vertical axis of the heat dissipating structure, and
- is enclosed, wherein
- the heat dissipating structure is electrically coupled to the electronics housing and the light source is coupled to a bottom of the heat sink,
- and under a condition that the light source is energized, air that rises from below the integrated ceiling device flows through,
- and then above, the central opening in the heat dissipating structure to cool the heat dissipating structure and the electronics housing.
10 more elements
An integrated ceiling device comprising:
- a heat dissipating structure comprising
- a unitary heat sink coupled to a plurality of fins disposed on top of the heat sink and distributed around a perimeter of the heat sink and a protective ring;
- an electronics housing sized to retain an electronics assembly therein,
- at least a portion of the electronics housing is disposed above a central portion of the heat dissipating structure and has a vertical axis that is substantially aligned with a vertical axis of the heat dissipating structure,
- a plurality of through openings form a through air gap between the protective ring and an outer perimeter of the heat dissipating structure,
- wherein
- the electronics housing is enclosed and coupled to the heat dissipating structure,
- a gap between the electronics housing and the heat dissipating structure exposes a substantial portion of the external surfaces of the electronics housing and the heat dissipating structure to flow of air,
- the heat dissipating structure is electrically coupled to the electronics housing,
- the integrated ceiling device further comprising
- at least one light source coupled to a bottom of the heat sink;
- a communication device is coupled to the electronics housing;
- and
- a power consuming device coupled to the integrated ceiling device and that is communicatively coupled to a remote power consuming device.
11 more elements
Dependencies are inferred from the claim text.