Cooling system for the liquid immersion cooling of electronic components

A cooling system for the liquid immersion cooling of electronic components, comprising:

• a container having a container wall, an interior, a reservoir in the interior for liquid heat transfer fluid and a gas space for gaseous heat transfer fluid;
• positioning devices for electronic components arranged in the reservoir;
• and
• a heat exchanger device with a plurality of heat exchanger tubes in the gas space of the container for liquefying the gaseous heat transfer fluid, the heat exchanger tubes having respective outer sides with outer fins thereon, the heat exchanger tubes passing into the container wall or through the container wall at passage points, the heat exchanger tubes having an integral bond with the container wall at the passage points, at least a first one of the plurality of heat exchanger tubes comprising a first material and at least a second one of the plurality of heat exchanger tubes comprising a second material differing from the first material.