Electronic circuit manufacturing method for self-assembly to another electronic circuit

A method of manufacturing an electronic circuit extending along a main plane, the manufacturing method comprising:

• a) a step of forming, by a damascene method by means of a pattern, an assembly site on a support, the assembly site being formed of an alternation of conductive pads made of a conductive material and of insulating posts made of a dielectric material flush with a first surface of the assembly site, the assembly site being delimited by insulating posts and surrounded with a peripheral area comprising a portion of the conductive material;
• b) a step of forming a second etching mask entirely covering the assembly site;
• c) a complementary step of etching, through the second etching mask, of the conductive material of the peripheral area, then a step of removal of the second etching mask, so that the assembly site forms a protrusion with respect to the support;
• and
• d) assembling the assembly site of the electronic circuit using a self-assembly method including a hybrid bonding step to another assembly site of another electronic circuit manufactured according to steps a), b), and c).