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US 12,476,611 B2Granted
Reduction of on-die parasitic capacitance for 5G filter design with high isolation
AssigneeSkyworks Solutions, Inc.
InventorsHai H. Ta, Shihan Qin, Nicholas Quinn Muhlmeyer, Weimin Sun
Life of this patent
Estimating the term…
Abstract
An acoustic wave filter assembly having reduced on-die capacitance and improved isolation for high-frequency applications. The acoustic wave filter assembly includes a filter port, an antenna port, an acoustic wave filter connected between the filter port and the antenna port, one or more ground pins connected between the filter port and the antenna port, and a metallic guard ring extending around the acoustic wave filter assembly. At least one of the one or more ground pins is connected to the metallic guard ring. A diplexer, multiplexer, radio-frequency module and wireless device are also provided.
Claims20
A filter assembly, comprising:
- a metallic guard ring extending around the filter assembly;
- an antenna port surrounded by the metallic guard ring;
- a filter port surrounded by the metallic guard ring;
- an acoustic wave filter connected between the antenna port and the filter port, the acoustic wave filter including one or more bulk acoustic wave resonators;
- and
- one or more ground pins connected between the filter port and the antenna port, at least one of the one or more ground pins being further connected to the metallic guard ring.
3 more elements
A diplexer comprising:
- a first acoustic wave filter connected between an antenna port and a first filter port, the first acoustic wave filter including one or more bulk acoustic wave resonators;
- a second acoustic wave filter connected between the antenna port and a second filter port, the second acoustic wave filter including one or more bulk acoustic wave resonators;
- a metallic guard ring extending around the first and second acoustic wave filters and about the antenna port, first filter port, and second filter port;
- and
- one or more ground pins connected between the antenna port and the first and second filter ports, at least one of the one or more ground pins being further connected to the metallic guard ring.
2 more elements
A multiplexer formed on a semiconductor chip and comprising:
- a first filter assembly including a first antenna port, one or more first filter ports, one or more first acoustic wave filters connected between the first antenna port and the one or more first filter ports, and one or more ground pins;
- a second filter assembly including a second antenna port, one or more second filter ports, one or more second acoustic wave filters connected between the second antenna port and the one or more second filter ports, and one or more ground pins, at least one of the one or more second filter ports being located between the first antenna port and the second antenna port;
- and
- a metallic guard ring extending around the first and second filter assemblies, at least one of the one or more ground pins of the first filter assembly being connected to the metallic guard ring, and at least one of the one or more ground pins of the second filter assembly being connected to the metallic guard ring.
1 more element
A radio-frequency module, comprising:
- a packaging substrate configured to receive a plurality of components;
- a first diplexer including a first filter assembly including a first antenna port, one or more first filter ports, one or more first acoustic wave filters connected between the first antenna port and the one or more first filter ports, and one or more ground pins, and a second filter assembly including a second antenna port, one or more second filter ports, one or more second acoustic wave filters connected between the second antenna port and the one or more second filter ports, and one or more ground pins, at least one of the one or more second filter ports being located between the first antenna port and the second antenna port;
- a second diplexer including a plurality of acoustic wave filters and one or more ground pins;
- and
- a metallic guard ring extending around the first and second diplexers, at least one of the one or more ground pins of the first diplexer being connected to the metallic guard ring, and at least one of the one or more ground pins of the second diplexer being connected to the metallic guard ring.
2 more elements
A wireless device, comprising:
- a transceiver configured to generate a radio-frequency signal;
- a front-end module in communication with the transceiver, the front-end module including a packaging substrate configured to receive a plurality of components, the front-end module further including a first diplexer a first filter assembly including a first antenna port, one or more first filter ports, one or more first acoustic wave filters connected between the first antenna port and the one or more first filter ports, and one or more ground pins, and a second filter assembly including a second antenna port, one or more second filter ports, one or more second acoustic wave filters connected between the second antenna port and the one or more second filter ports, and one or more ground pins, at least one of the one or more second filter ports being located between the first antenna port and the second antenna port, a second diplexer having a plurality of acoustic wave filters and one or more ground pins, and a metallic guard ring extending around the first and second diplexers, at least one of the one or more ground pins of the first diplexer being connected to the metallic guard ring, and at least one of the one or more ground pins of the second diplexer being connected to the metallic guard ring;
- and
- an antenna in communication with the front-end module.
1 more element
Dependencies are inferred from the claim text.