Packaged electronic components
AssigneeZhuhai Crystal Resonance Technologies Co., Ltd.
InventorsDror Hurwitz, BawChing Perng, Duan Feng
Life of this patent
Estimating the term…
Abstract
A package for an electronic component, the package comprising a front end, a back end, and an active membrane layer sandwiched between front and back electrodes of conducting material; wherein front electrode has a surface that extends beyond an adjacent surface of the active membrane layer, the active membrane mechanically supported by the front end and covered by a back end comprising at least one back cavity having organic walls and lid of organic material, with filled through vias traversing the organic walls and lid for coupling to the electrodes by an internal routing layer; the vias being coupleable by external solderable bumps to a circuit board for coupling the package in a flip chip configuration.
Claims21
A package for an electronic component, the package comprising:
- a front end;
- a back end;
- and
- an active membrane layer sandwiched between front and back electrodes of conducting material, the active membrane layer having two corresponding lateral ends, the back electrode having two corresponding lateral ends, the front electrode having two corresponding lateral ends;
- a first adjacent surface of the active membrane layer in contact with the front electrode substantially along an entire length of the first adjacent surface, the front electrode having a surface that extends a first distance between the lateral ends of the front electrode along a first direction and beyond the first adjacent surface of the active membrane layer at both lateral ends of the active membrane layer, both lateral ends of the active membrane layer being in contact with the front electrode, a second adjacent surface of the active membrane layer in contact with the back electrode, the second adjacent surface extending beyond both lateral ends of the back electrode, the active membrane being mechanically supported by the front end and covered by the back end, the package comprising at least one back cavity having walls and lid of organic material, with filled through vias traversing the organic walls and a lid for coupling to the electrodes by an internal routing layer, the back cavity having a dimension along the first direction which is less than the first distance of the front electrode;
- the vias being coupleable by external solderable bumps to a circuit board for coupling the package in a flip chip configuration.
A package for an electronic component, the package comprising:
- a front end;
- a back end;
- and
- an active membrane layer sandwiched between front and back electrodes of conducting material, the front electrode having two corresponding lateral ends, the active membrane layer having two corresponding lateral ends, the back electrode having a portion in contact with the active membrane, the portion having two corresponding lateral ends;
- a first adjacent surface of the active membrane layer in contact with the front electrode substantially along an entire length of the first adjacent surface, the front electrode having a surface that extends a first distance between the lateral ends of the front electrode along a first direction and beyond the first adjacent surface of the active membrane layer at both lateral ends of the active membrane layer, both lateral ends of the active membrane layer being in contact with the front electrode, the active membrane being mechanically supported by the front end and covered by the back end, the package comprising at least one back cavity having walls and lid of organic material, with filled through vias traversing the organic walls and a lid for coupling to the electrodes by an internal routing layer, the back cavity having a dimension along the first direction which is less than the first distance of the front electrode;
- the vias being coupleable by external solderable bumps to a circuit board for coupling the package in a flip chip configuration.
A package for an electronic component, the package comprising:
- a front end;
- a back end;
- and
- an active membrane layer sandwiched between front and back electrodes of conducting material, the active membrane layer having two corresponding lateral ends, the back electrode having two corresponding lateral ends, the front electrode having two corresponding lateral ends;
- the front electrode having a surface that extends a first distance between the lateral ends of the front electrode along a first direction and beyond the first adjacent surface of the active membrane layer at both lateral ends of the active membrane layer, the active membrane being mechanically supported by the front end and covered by the back end, the package comprising at least one back cavity having walls and lid of organic material, with filled through vias traversing the organic walls and a lid for coupling to the electrodes by an internal routing layer, the back cavity having a dimension along the first direction which is less than the first distance of the front electrode;
- the vias being coupleable by external solderable bumps to a circuit board for coupling the package in a flip chip configuration.
Dependencies are inferred from the claim text.