Vertical cavity surface emitting laser
AssigneeSumitomo Electric Industries, Ltd.
InventorTakeshi Aoki
Life of this patent
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Abstract
A vertical cavity surface emitting laser includes a post provided at a major surface of a substrate and extending along a first axis intersecting the major surface of the substrate, and an electrode provided at an upper surface of the post and surrounding the first axis. The post includes a first distributed Bragg reflector, an active layer, a current confinement layer, and a second distributed Bragg reflector. The substrate, the first distributed Bragg reflector, the active layer, the current confinement layer, and the second distributed Bragg reflector are disposed in order in a direction of the first axis.
Claims5
A vertical cavity surface emitting laser comprising:
- a post provided at a major surface of a substrate and extending along a first axis intersecting the major surface of the substrate;
- and
- an electrode provided at an upper surface of the post and surrounding the first axis,
- wherein:
- the post includes a first distributed Bragg reflector, an active layer, a current confinement layer, and a second distributed Bragg reflector,
- the substrate, the first distributed Bragg reflector, the active layer, the current confinement layer, and the second distributed Bragg reflector are disposed in order in a direction of the first axis,
- the second distributed Bragg reflector includes a semiconductor region and a first high-resistance region surrounding the semiconductor region,
- the first high-resistance region has an electrical resistance that is higher than an electrical resistance of the semiconductor region,
- the current confinement layer includes an aperture portion and an oxidized portion surrounding the aperture portion,
- the first axis passes through the semiconductor region and the aperture portion,
- a length of a longest line segment of line segments connecting any two points on an inner edge of the oxidized portion in a section orthogonal to the first axis is D1, a length of a longest line segment of line segments connecting any two points on an inner edge of the first high-resistance region in the section orthogonal to the first axis is D2, and a value of D2/D1 is greater than 1 and is 2.5 or less,
- the second distributed Bragg reflector includes a second high-resistance region having an electrical resistance that is higher than the electrical resistance of the first high-resistance region,
- the second high-resistance region surrounds the semiconductor region,
- the second high-resistance region is disposed between the electrode and the first high-resistance region in the direction of the first axis,
- the second high-resistance region has an inner edge that is positioned farther away than an inner edge of the first high-resistance region from the first axis in a direction orthogonal to the first axis, and
- the first high-resistance region and the second high-resistance region respectively have a first thickness and a second thickness along the direction of the first axis, the second thickness being smaller than the first thickness.
A vertical cavity surface emitting laser comprising:
- a post provided at a major surface of a substrate and extending along a first axis intersecting the major surface of the substrate;
- and
- an electrode provided at an upper surface of the post and surrounding the first axis,
- wherein;
- the post includes a first distributed Bragg reflector, an active layer, a current confinement layer, and a second distributed Bragg reflector,
- the substrate, the first distributed Bragg reflector, the active layer, the current confinement layer, and the second distributed Bragg reflector are disposed in order in a direction of the first axis,
- the second distributed Bragg reflector includes a semiconductor region and a first high-resistance region surrounding the semiconductor region,
- the first high-resistance region has an electrical resistance that is higher than an electrical resistance of the semiconductor region,
- the current confinement layer includes an aperture portion and an oxidized portion surrounding the aperture portion,
- the first axis passes through the semiconductor region and the aperture portion,
- in a direction orthogonal to the first axis, a distance between an inner edge of the oxidized portion and an inner edge of the first high-resistance region is 3 μm or less,
- the second distributed Bragg reflector includes a second high-resistance region having an electrical resistance that is higher than the electrical resistance of the first high-resistance region,
- the second high-resistance region surrounds the semiconductor region,
- the second high-resistance region is disposed between the electrode and the first high-resistance region in the direction of the first axis,
- the second high-resistance region has an inner edge that is positioned farther away than an inner edge of the first high-resistance region from the first axis in a direction orthogonal to the first axis, and
- the first high-resistance region and the second high-resistance region respectively have a first thickness and a second thickness along the direction of the first axis, the second thickness being smaller than the first thickness.
Dependencies are inferred from the claim text.