Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protection

A method for producing an electronic component having an electromagnetic shield, the method comprising:

• sticking a temporary protective material to a first portion of a body to be processed, wherein the temporary protective material embeds irregularities on a surface of the body to be processed;
• photocuring the temporary protective material by a light irradiation;
• singularizing the body to be processed and the temporary protective material;
• forming a metal film on a second portion of the singularized body where the temporary protective material is not stuck, the metal film providing the second portion of the body with the electromagnetic shield;
• and
• detaching the singularized body having the metal film formed thereon from the temporary protective material to obtain the electronic component having the electromagnetic shield,
• wherein the temporary protective material is formed from a resin composition having a shear viscosity at 35° C. of 5000 to 30000 Pa·s, before said photocuring by the light irradiation, and having an elastic modulus at 25° C. of 100 MPa or less and an elongation percentage of 35% or more in a tensile test, after said photocuring by the light irradiation with an exposure amount of 500 mJ/cm2 or greater.