Curable resin composition, cured film, laminate, method for manufacturing cured film, semiconductor device, and polymer precursor
AssigneeFUJIFILM Corporation
InventorAtsuyasu Nozaki
Life of this patent
Estimating the term…
Abstract
There are provided a curable resin composition containing at least one polymer precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, where the polymer precursor has a heterocyclic ring structure containing two or more nitrogen atoms and an acid value of the polymer precursor is 1 mmol/g or less, a cured film that is obtained by curing the curable resin composition, a laminate that includes the cured film, a method for manufacturing the cured film, and a semiconductor device including the cured film or the laminate, and a novel polymer precursor.
Claims13
A curable resin composition comprising:
- at least one polymer precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor,
- wherein the polymer precursor has a heterocyclic ring structure containing two or more nitrogen atoms, and
- an acid value of the polymer precursor is 1 mmol/g or less,
- wherein the polymer precursor has a repeating unit represented by formula (PI-A1) or formula (PB-A1),
- in formula (PI-A1) and (PB-A1), A1 and A2 each independently represent an oxygen atom or —NH—, R111 represents a divalent organic group, R115 represents a tetravalent organic group, R113 and R114 each independently represent a hydrogen atom or a monovalent organic group, and *P1 and *P2 each independently represent a bonding site to another structure, where at least one of R113 or R114 has a heterocyclic ring structure containing two or more nitrogen atoms and *P1 is bonded to a structure containing a heterocyclic ring structure containing two or more nitrogen atoms, and R121 represents a divalent organic group, R122 represents a tetravalent organic group, R123 and R124 each independently represent a hydrogen atom or a monovalent organic group, and *B1 and *B2 each independently represent a bonding site to another structure, where at least one of R124 or R123 has a heterocyclic ring structure containing two or more nitrogen atoms and *B2 is bonded to a structure containing a heterocyclic ring structure containing two or more nitrogen atoms.
A polymer precursor that is at least one polymer precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, the polymer precursor comprising:
- a repeating unit represented by Formula (PI-B1) or a repeating unit represented by Formula (PB-B1),
- wherein an acid value of the polymer precursor is 1 mmol/g or less
- in Formulae (PI-B1) or (PB-B1), A1 and A2 each independently represent an oxygen atom or —NH—, R111 represents a divalent organic group, R115 represents a tetravalent organic group, R113 and R114 each independently represent a hydrogen atom or a monovalent organic group, and *P1 and *P2 each independently represent a bonding site to another structure, where at least one of R113 or R114 has a heterocyclic ring structure containing two or more nitrogen atoms and *P1 is bonded to a structure containing a heterocyclic ring structure containing two or more nitrogen atoms, and R121 represents a divalent organic group, R122 represents a tetravalent organic group, R123 and R124 each independently represent a hydrogen atom or a monovalent organic group, and *B1 and *B2 each independently represent a bonding site to another structure, where at least one of R124 or R123 has a heterocyclic ring structure containing two or more nitrogen atoms and *B2 is bonded to a structure containing a heterocyclic ring structure containing two or more nitrogen atoms.
Dependencies are inferred from the claim text.