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US 12,472,708 B2Granted
Treatment of parts by vaporized solvent
AssigneePeridot Print LLC
InventorsArnau Mestres Rosas, Ariadna Marin Camara, Natalie Harvey, Xavier Gasso Puchal
Life of this patent
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Abstract
A method is described in which a part is placed within a chamber. Vaporized solvent is provided within the chamber such that the solvent condenses onto and treats the part. A vacuum is then applied to the chamber to extract the solvent and stop the treatment. The vacuum is controlled such that a pressure within the chamber over time has a predefined profile to prevent defects in the part from occurring due to the extraction of solvent from the part.
Claims18
A method comprising:
- placing a part within a chamber;
- providing vaporized solvent within the chamber such that the solvent condenses onto the part and treats the part via chemical-mechanical polishing (CMP);
- applying a vacuum to the chamber to extract the solvent and stop treatment of the part via the CMP;
- and
- controlling reduction of pressure within the chamber over time to apply the vacuum, according to a predefined time-pressure profile, to at least reduce defects in the part occurring due to the extraction of solvent from the part during application of the vacuum that stops the CMP.
2 more elements
A method comprising:
- providing a part within a chamber;
- causing vaporized solvent to condense onto the part such that the part is treated via chemical-mechanical polishing (CMP);
- applying a vacuum to the chamber to extract the solvent and stop treatment of the part via the CMP;
- and
- controlling reduction of pressure within the chamber over time to apply the vacuum, according to a predefined time-pressure profile, to prevent at least reduce defects in the part caused by extraction of the solvent during application of the vacuum that stops the CMP,
- wherein the predefined time-pressure profile is defined by at least one of:
- (i) a material of the part, (ii) a geometry of the part, (iii) a composition of the solvent, (iv) a quantity of the vaporized solvent, (v) a temperature within the chamber, and (vi) a solvent exposure time.
4 more elements
A processing station comprising:
- a chamber to receive a part;
- a solvent delivery system to deliver solvent within the chamber to treat the part via chemical-mechanical polishing (CMP);
- a vacuum pump to apply a vacuum to the chamber to extract the solvent and stop treatment of the part via the CMP;
- and
- a controller to control the vacuum pump to control reduction of pressure within the chamber over time to apply the vacuum, according to a predefined time-pressure profile, to at least reduce defects in the part occurring due to extraction of solvent from the part during application of the vacuum that stops the CMP.
2 more elements
Dependencies are inferred from the claim text.