Bonding method
AssigneeNHK Spring Co., Ltd.
InventorsHidetoshi Mizuta, Atom Furuse, Kaoru Nagasawa, Fumitaka Arai
Life of this patent
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Abstract
A bonding method bonds a buffer member to an adherend member, and includes: an adhesive application step of applying an adhesive to a part of the buffer member, the part being bonded to the adherend member; a first heating step of heating a part of the adherend member, the part being bonded to the buffer member; a second heating step of heating the part of the adherend member after the first heating step; and an attachment step of attaching the buffer member to the adherend member after the second heating step.
Claims8
A bonding method for bonding a buffer member to an adherend member, the bonding method comprising:
- an adhesive application step of applying an adhesive to a part of the buffer member, the part being bonded to the adherend member;
- a first heating step of heating a part of the adherend member, the part being bonded to the buffer member;
- a second heating step of heating the part of the adherend member after the first heating step;
- and
- an attachment step of attaching the buffer member to the adherend member after the second heating step.
Dependencies are inferred from the claim text.