Grounding techniques for ESD polymeric fluid lines

A chemical mechanical polishing assembly, comprising:

• a chemical mechanical polishing system including a platen to support a polishing pad, a carrier head to support a substrate and bring the substrate into contact with the polishing pad, and a motor to cause relative motion between platen and the carrier head
• a reservoir to hold a polishing fluid
• a steam source configured to generate steam;
• a fluid delivery conduit coupled to the reservoir and the steam source such that the steam is injected into the polishing fluid;
• and
• a dispenser coupled to the fluid delivery conduit and configured to deliver the steam-injected polishing fluid to the polishing pad, the fluid delivery conduit comprising:
• a conductive wire extending through an interior of the conduit to flow electrostatic discharge to a ground;
• and
• a ground extraction fitting providing a sealed electrical connection through a wall of the fluid delivery conduit between the conductive wire and the ground.

A chemical mechanical polishing assembly, comprising:

• a chemical mechanical polishing system including a platen to support a polishing pad, a carrier head to support a substrate and bring the substrate into contact with the polishing pad, and a motor to cause relative motion between the platen and the carrier head, wherein, during relative motion between the platen and the carrier head, the system does not apply a voltage to the platen;
• a fluid source, wherein the chemical mechanical polishing system includes a dispenser to deliver the fluid source to the polishing pad;
• and
• a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system, the fluid delivery conduit including
• a conductive wire extending through an interior of the conduit to flow electrostatic discharge to a ground;
• and
• a ground extraction fitting providing a sealed electrical connection through a wall of the fluid delivery conduit between the conductive wire and the ground.