Method of processing a substrate and system for processing a substrate
AssigneeDisco Corporation
InventorsKarl Heinz Priewasser, Naoko Yamamoto
Life of this patent
Estimating the term…
Abstract
A substrate having a first side and a second side opposite to the first side is processed by attaching a protective film to the first side and, after attachment, processing the substrate from the second side of the substrate. After processing from the second side, the second side is inspected for defects on the second side of the substrate. After inspection for defects, a support film is attached to the second side of the substrate. The protective film is removed from the first side of the substrate and, after removing the protective film, the first side of the substrate is inspected for defects on the first side of the substrate.
Claims20
A method of processing a substrate, the substrate having a first side and a second side being opposite to the first side, wherein the method comprises:
- attaching a protective film to the first side of the substrate;
- after attaching the protective film to the first side of the substrate, processing the substrate from the second side of the substrate;
- after processing the substrate from the second side of the substrate, inspecting the second side of the substrate for defects from the second side of the substrate;
- after inspecting the second side of the substrate for defects, attaching a support film to the second side of the substrate;
- removing the protective film from the first side of the substrate;
- and
- after removing the protective film from the first side of the substrate, inspecting the first side of the substrate for defects from the first side of the substrate.
A system for processing a substrate, the substrate having a first side and a second side being opposite to the first side, wherein the system comprises:
- an attaching means configured to attach a protective film to the first side of the substrate;
- a processing means configured to process the substrate from the second side of the substrate, after attaching the protective film to the first side of the substrate;
- an inspection means configured to inspect the second side of the substrate for defects from the second side of the substrate, after processing the substrate from the second side of the substrate;
- an attaching means configured to attach a support film to the second side of the substrate, after inspecting the second side of the substrate for defects;
- a protective film removing means configured to remove the protective film from the first side of the substrate;
- and
- an inspection means configured to inspect the first side of the substrate for defects from the first side of the substrate, after removing the protective film from the first side of the substrate.
Dependencies are inferred from the claim text.