Semiconductor structure and method of manufacturing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Chien Hsieh, Yun-Wei Cheng, Kuo-Cheng Lee, Cheng-Ming Wu, Ping Kuan Chang
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Chien Hsieh, Yun-Wei Cheng, Kuo-Cheng Lee, Cheng-Ming Wu, Ping Kuan Chang
Estimating the term…
The present disclosure provides a semiconductor structure and a method of manufacturing the same. The semiconductor structure includes a sensing device, a solar cell, and an interconnecting structure. The solar cell is disposed above the sensing device and is electrically connected to the sensing device. The interconnecting structure is disposed between the sensing device and the solar cell and has a first surface facing the solar cell and a second surface facing the sensing devices. The interconnecting structure comprises a first energy storage component and a second energy storage component. The first energy storage component is disposed closer to the first surface of the interconnecting structure than the second energy storage component.
A semiconductor structure, comprising:
A semiconductor structure, comprising:
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.