Semiconductor component having a SiC semiconductor body
AssigneeInfineon Technologies AG
InventorsAndreas Peter Meiser, Caspar Leendertz, Anton Mauder
Life of this patent
Estimating the term…
Loading patent…
AssigneeInfineon Technologies AG
InventorsAndreas Peter Meiser, Caspar Leendertz, Anton Mauder
Estimating the term…
A semiconductor component includes: a SiC semiconductor body; a trench extending from a first surface of the SiC semiconductor body into the SiC semiconductor body, the trench having a conductive connection structure, a structure width at a bottom of the trench, and a dielectric layer covering sidewalls of the trench; a shielding region along the bottom and having a central section which has a lateral first width; and a contact formed between the conductive connection structure and the shielding region. The conductive connection structure is electrically connected to a source electrode. In at least one doping plane extending approximately parallel to the bottom, a dopant concentration in the central section deviates by not more than 10% from a maximum value of the dopant concentration in the shielding region in the doping plane. The first width is less than the structure width and is at least 30% of the structure width.
A semiconductor component, comprising:
A semiconductor component, comprising:
Dependencies are inferred from the claim text.