Low latency retimer and low latency control method
AssigneeMontage Electronics (Shanghai) Co., Ltd.
InventorsYu Hong, Shan Wang, Ranran Fan, Dan Wang, Zhongyuan Chang
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AssigneeMontage Electronics (Shanghai) Co., Ltd.
InventorsYu Hong, Shan Wang, Ranran Fan, Dan Wang, Zhongyuan Chang
Estimating the term…
A low latency retimer and a low latency control method are provided; a physical layer module is provided on each of two opposite sides of the retimer; each physical layer module includes at least one set of signal transceiver units including a signal receiving unit and a signal transmitting unit; the signal receiving unit performs a serial-to-parallel conversion on a first high-speed serial signal to generate a parallel signal, and sends the parallel signal to the signal transmitting unit; the signal transmitting unit performs a parallel-to-serial conversion on the parallel signal, to convert the parallel signal to obtain a second high-speed serial signal, and outputs the second high-speed serial signal. Data paths of the retimer form a loopback structure, and the signal transmitting unit and the signal receiving unit are physically adjacent to each other, which solves the problem of signal transmission delay, and avoids high power consumption.
A low latency retimer, comprising two physical layer modules, wherein the physical layer modules comprise a first physical layer module is provided on a first side of a chip package of the retimer, and a second physical layer module provided on a second side of the chip package opposite to the first side, wherein each physical layer module comprises at least one set of signal transceiver units, wherein each set of the signal transceiver units comprises a signal receiving unit and a signal transmitting unit;
A low latency control method, wherein, the method is applied to a retimer, the retimer comprises two physical layer modules comprising a first physical layer module on a first side of a chip package of the retimer, and a second physical layer module provided on a second side of the chip package opposite to the first side, each physical layer module comprises at least one set of signal transceiver units comprising a signal receiving unit and a signal transmitting unit;
Dependencies are inferred from the claim text.