Substrate having a metal layer comprising a marking
AssigneeSkyworks Solutions, Inc.
InventorsAtsushi Takano, Mitsuhiro Furukawa
Life of this patent
Estimating the term…
Abstract
A method of marking information on a substrate for use in a semiconductor component is provided. The method comprises providing a substrate for use in a semiconductor component, providing a metal layer on a surface of the substrate, and providing a marking within the metal layer. A method of making a die, a radio-frequency module and a wireless mobile device; as well as a substrate, a die, a radio-frequency module and a wireless mobile device is also provided.
Claims16
A method of marking information on a substrate for use in a semiconductor component, the method comprising:
- providing a substrate for use in a semiconductor component;
- providing a metal layer on a surface of the substrate;
- and
- providing a marking within the metal layer,
- the providing a metal layer on a surface of the substrate and the providing a marking within the metal layer including providing a photoresist in the shape of the marking on the surface of the substrate, and depositing the metal layer around the photoresist to form the metal layer including the marking.
A method of marking information on a substrate for use in a semiconductor component, the method comprising:
- providing a substrate for use in a semiconductor component, the substrate including one or more cap wafers;
- providing a metal layer on a surface of the substrate;
- providing a marking within the metal layer;
- integrating the substrate into the semiconductor component;
- providing a device wafer having an electronic component disposed thereon, the device wafer including a plurality of electronic components arranged in groups of one or more electronic components, each group corresponding to a separate die, the metal layer including the marking corresponding to each group;
- bonding the cap wafer and the device wafer such that an inner surface of the cap wafer faces the device wafer, the metal layer including the marking being provided on the inner surface of the cap wafer;
- and
- separating each die subsequent to bonding the cap wafer and the device wafer.
A method of marking information on a substrate for use in a semiconductor component, the method comprising:
- providing a substrate for use in a semiconductor component, the substrate including one or more cap wafers;
- providing a metal layer on a surface of the substrate;
- providing a marking within the metal layer;
- integrating the substrate into the semiconductor component;
- providing a device wafer having an electronic component disposed thereon;
- and
- bonding the cap wafer and the device wafer such that an inner surface of the cap wafer faces the device wafer, the metal layer including the marking being provided on the inner surface of the cap wafer, the bonding of the cap wafer and the device wafer including forming a hermetic seal around the electronic component.
A method of marking information on a substrate for use in a semiconductor component, the method comprising:
- providing a substrate for use in a semiconductor component, the substrate including one or more cap wafers;
- providing a metal layer on a surface of the substrate;
- providing a marking within the metal layer;
- integrating the substrate into the semiconductor component;
- providing a device wafer having an electronic component disposed thereon;
- and
- bonding the cap wafer and the device wafer such that an inner surface of the cap wafer faces the device wafer, the metal layer including the marking being provided on the inner surface of the cap wafer, and the marking including one or more letters and/or numbers and each of the letters and/or numbers being formed backwards on the inner surface of the cap wafer such that when viewed through the cap wafer from an outer surface opposite the inner surface each of the letters and/or numbers are correctly oriented.
Dependencies are inferred from the claim text.