Probe device
AssigneeTecat Technologies (Suzhou) Limited
InventorChoon Leong Lou
Life of this patent
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Abstract
The present disclosure provides a probe device. The probe device includes a first probe structure and a second probe structure. The first probe structure includes: a first body, a first substrate and a plurality of first probes. The first substrate is disposed on the first body. The first probes electrically connects to the first substrate and protrudes from a surface of the first substrate. The second probe structure includes: a second body, a second substrate and a plurality of second probes. The second body has a plurality of through holes. The second probes electrically connects to the second substrate and protrudes from a surface of the second body through the through holes. The length of the first probe is different from the length of the second probes.
Claims9
A probe device, comprising:
- a first probe structure, comprising:
- a first body;
- a first substrate, disposed on the first body;
- and
- a plurality of first probes, electrically connected to the first substrate and protruding from a surface of the first substrate;
- a second probe structure, comprising:
- a second body, having a plurality of through holes;
- a second substrate, disposed on the second body;
- and
- a plurality of second probes, electrically connected to the second substrate, wherein the plurality of second probes protrude from a surface of the second body via the plurality of through holes, respectively;
- and
- a circuit board, wherein the first probe structure is disposed in a first region of the circuit board, and the second probe structure is disposed in a second region of the circuit board, wherein the first region surrounds the second region,
- wherein a length of the plurality of first probes is different from a length of the plurality of second probes, and
- wherein the first probe structure is free from having a through hole.
A probe device, comprising:
- a first probe structure, comprising:
- a first body;
- a first substrate, disposed on the first body;
- and
- a plurality of first probes, disposed on the first substrate to correspond to a layout of a plurality of first contacts of an object under test, and are configured to test high-frequency signals;
- a second probe structure, comprising:
- a second body, having a plurality of through holes;
- a second substrate, disposed on the second body;
- and
- a plurality of second probes, disposed on the second substrate via the plurality of through holes of the second body to correspond to a layout of a plurality of second contacts of the object under test, respectively, and are configured to test digital signals;
- and
- a circuit board, wherein the first probe structure is disposed in a first region of the circuit board, and the second probe structure is disposed in a second region of the circuit board, wherein the first region surrounds the second region,
- wherein the first probe structure is free from having a through hole.
Dependencies are inferred from the claim text.